PCB News - Manufacturing method of optical fiber circuit board

Manufacturing method of optical fiber circuit board

As the processing speed of the core processor in the mobile phone is growing rapidly, and the performance of the external components is also improved due to the improvement of the performance of the core processor, the specifications of the external components are also improved. For example, the camera module has increased the pixels, and relatively more data transmission is required; the LCD display module has increased the LCD display pixels, making the picture more detailed and perfect, and it also requires a greater data transmission.

How to solve a larger amount of data transmission than in the past is generally adopted to increase the number of data transmission channels of the traditional flexible circuit board connection line, thereby increasing the transmission volume. In addition, because optical fiber is used for optical signal transmission, the main advantage of optical signal transmission is that it will not be interfered by electromagnetic waves (EMI), and the speed of light is faster than that of electricity. Therefore, the use of optical fiber for data transmission is much faster than copper wire transmission. .

In view of this, it is necessary to provide a fiber optic circuit board and a method for manufacturing the fiber optic circuit board with a small overall height and low optical transmission loss.

An optical fiber circuit board, comprising a flexible substrate, the flexible substrate comprising a substrate and an adhesive layer and a copper layer on the substrate, the copper layer being provided on the substrate through the adhesive layer, After part of the copper layer is etched away, the flexible optical waveguide is used to transmit optical signals.

A method for manufacturing an optical fiber circuit board, comprising the steps of: providing a soft base material and cutting the soft base material, the soft base material comprising a substrate and a copper layer arranged on the substrate; and opening holes on the soft base material And coating the inner wall of the hole; setting a photosensitive layer on the soft substrate after the coating is completed; exposing and developing the photosensitive layer to form a bare copper area; etching the copper layer on the bare copper area to form a waveguide area; removing excess The photosensitive layer; the flexible optical waveguide is set in the waveguide area and the insulating layer is pasted; the optical window corresponding to the flexible optical waveguide is opened to expose the flexible optical waveguide.

Compared with the prior art, the optical fiber circuit board of this embodiment uses an optical waveguide to transmit signals to adapt to the ability of high-speed signal transmission; in addition, the flexible optical waveguide and the flexible substrate can be made together to achieve a smaller volume. Reduce the cost of separate assembly of optoelectronics and alignment problems during assembly, thereby reducing transmission loss.

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