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PCB News - Multilayer circuit board manufacturers: the difference between dry film and wet film

PCB News

PCB News - Multilayer circuit board manufacturers: the difference between dry film and wet film

Multilayer circuit board manufacturers: the difference between dry film and wet film

2021-08-28
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Author:Aure

Multilayer circuit board manufacturers: the difference between dry film and wet film

There are two ways for multi-layer circuit board manufacturers to make circuits, one is to use dry film production, the other is to use wet film production, then what is the difference between the two? Please listen to the editor of Shenzhen multilayer circuit board manufacturer telling you in detail.

The dry film and wet film in the multi-layer circuit board manufacturers refer to the raw materials used to make the circuit. The dry film is a polymer compound, which can produce a kind of polymerization reaction after being irradiated by ultraviolet rays. The stable substance is attached to the surface of the circuit board to achieve the function of blocking electroplating and etching. Wetfilm is a kind of photosensitive ink, which is sensitive to purple line and can be cured by ultraviolet light.


Multilayer circuit board manufacturers: the difference between dry film and wet film

1. The functions of dry film and wet film are basically similar, but if the surface is relatively uneven or does not have to build a thicker height or very thin film thickness, multilayer circuit board manufacturers can consider using wet film. If it is a circuit board with holes, a dry film will be more suitable. And if the environment is not easy to keep clean, the dry film is also easier to control the quality of the operation. Although the materials of wet film are relatively cheap, they are not available everywhere. In addition to general considerations in use, consideration should be given to the operating environment requirements of the circuit board manufacturer.

2. The dry film is easy to handle, but the unit price is slightly higher than that of the wet film. But because it is easy to keep clean, and does not need to be baked, the workability is also better, so it is more advantageous in use. However, it is not easy to achieve a thin film thickness, especially a dry film with a thickness of 15 μm or less. In addition, the better filling capacity of the wet film is its advantage, but because there is no protective film, higher exposure energy is required. Different viewpoints have different pros and cons. This must be compared by the user to get a better fit. The conclusion.

3. At present, the so-called wet film is almost always used for soldering paint. As for the application of inner circuit boards, the proportion of wet film is getting higher and higher. This is because of the low price and the gradual technological maturity. For the sake of improvement. But both are in terms of inner circuit board production.

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