PCB News - The weather is so hot, let’s talk about how to cool down the PCB circuit board

The weather is so hot, let’s talk about how to cool down the PCB circuit board

The weather is so hot, let’s talk about how to cool down the PCB circuit board
PCB factory editor: Since the weather is so hot, today we will talk about the cooling design of the circuit board.

For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating. The reliability of the electronic equipment Performance will decrease. Therefore, it is very important to conduct a good heat dissipation treatment on the circuit board.

PCB circuit board design is a downstream process that follows the principle design. The quality of the design directly affects the product performance and the market cycle. We know that the devices on the circuit board have their own working environment temperature range. If this range is exceeded, the working efficiency of the device will be greatly reduced or failure, resulting in damage to the device. Therefore, heat dissipation is an important consideration in PCB circuit board design.

Then, the editor of Yuwei Electronics will let you know how to conduct heat dissipation.

The heat dissipation of the PCB circuit board is related to the selection of the board, the selection of the components, and the layout of the components. Among them, the layout plays a pivotal role in the heat dissipation of the PCB, and it is a key part of the heat dissipation design of the circuit board. When making layouts, engineers need to consider the following aspects:

1. Centralized design and installation of components with high heat generation and large radiation on another PCB circuit board, so as to conduct separate centralized ventilation and cooling to avoid mutual interference with the motherboard;

2. The heat capacity of the PCB circuit board is evenly distributed. Do not place high-power components in a concentrated manner. If it is unavoidable, place short components upstream of the airflow and ensure sufficient cooling air flow through the heat consumption concentrated area;

3. Make the heat transfer path as short as possible;

4. Make the heat transfer cross section as large as possible;

5. Pay attention to the same direction of forced ventilation and natural ventilation;

6. Make the intake and exhaust as far away as possible;

7. The additional sub-boards and device air ducts are consistent with the ventilation direction;

8. The heating device should be placed above the product as much as possible, and should be placed on the airflow channel when conditions permit;

9. The layout of components should take into account the influence of heat radiation on surrounding parts. Heat sensitive parts and components (including semiconductor devices) should be kept away from heat sources or isolated;

10. Do not place components with high heat or high current on the corners and edges of the PCB circuit board. Install the heat sink as much as possible, keep it away from other components, and ensure that the heat dissipation channel is unobstructed.

Reminder: Adding a heat sink to the device is also a good way to dissipate heat.