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PCB News - Six reasons why PCB circuit board pads are not easy to tin

PCB News

PCB News - Six reasons why PCB circuit board pads are not easy to tin

Six reasons why PCB circuit board pads are not easy to tin

2021-08-23
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Author:Aure

Six reasons why PCB circuit board pads are not easy to tin

Everyone knows that it is not easy to tin on the PCB circuit board pads, which will affect the component placement, which indirectly leads to the failure of subsequent tests. The editor of the circuit board factory will introduce to you the reasons why PCB circuit board pads are not easy to tin. I hope that you can avoid these problems and reduce losses when making and using PCB circuit boards.
Reason 1: We need to consider whether it is a customer design problem, and we need to check whether there is a PCB circuit board (multilayer circuit board manufacturer) connection between the pad and the copper skin, which causes the pad to be insufficiently heated.
Reason two: the problem of improper storage.
Reason three: PCB circuit board factory (manufacturer of multilayer circuit board) dealt with the problem. There is oily material on the pad that has not been removed, and the pad surface has not been oxidized before leaving the factory.
Reason four: the problem of reflow soldering. If the preheating time is too long or the preheating temperature is too high, the flux activation will fail; the temperature is too low or the speed is too fast, and the tin does not melt.

Reason 5: Whether there is a problem with the customer's operation. If the welding method is wrong, it will lead to insufficient heating power, insufficient temperature, and insufficient contact time.


Six reasons why PCB circuit board pads are not easy to tin

Reason six: the problem of flux. The activity is not enough to completely remove the oxide material on the PCB pad or SMD soldering site. The amount of solder paste at the solder joint is insufficient, and the wetting performance of the flux in the solder paste is not good. Part of the solder joints is not full of tin, and it may not be fully stirred before use, and the flux and tin powder may not be fully fused.
The above is a summary of the reasons why PCB multilayer circuit board pads are not easy to tin on the PCB multi-layer circuit board introduced by the circuit board factory for your reference.
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