PCB Material List - F4BME-2-A Teflon pcb glass fabric copper-clad laminates

Types

F4BME-2-A255

F4BME-2-A262

F4BME-2-A275

F4BME-2-A285

F4BME-2-A294

F4BME-2-A300

Dimension(mm)

550*440

500*500

600*500

650*500

1000*850

1100*1000

1220*1000

1500*1000

For special dimension,customized laminates is available.

Thickness and Tolerance(mm)

Laminate thickness

0.254

0.508

0.762

0.787

1.016

Tolerance

±0.025

±0.05

±0.05

±0.05

±0.05

Laminate thickness

1.27

1.524

2.0

3.0

4.0

Tolerance

±0.05

±0.05

±0.075

±0.09

±0.1

Laminate thickness

5.0

6.0

9.0

10.0

12.0

Tolerance

±0.1

±0.12

±0.18

±0.18

±0.20

Mechanical Strength

Cutting/punching

Strength

Thickness1mm,no burrs after cutting,minimum space between two punching holes is 0.55mm,no delamination.

Thickness1mm,no burrs after cutting,minimum space between two punching holes is 1.10mm,no delamination.

Peel strength(1oz copper)

Normal state:≥14N/cm;No bubble, delamination, peel strength≥12N/cm(in the constant humidity and temperature, and keep in the melting solder of 265 degree Celsius±2 degree Celsius for 20 seconds).

Chemical Property

According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of laminate are not changed. The plating through hole can be done,but the sodium treatment or the plasma treatment must be used.

Electrical Property

Name

Test condition

Unit

Value

Density

Normal state

g/ cm3

2.1～2.35

Moisture Absorption

Dip in the distilled water of 20±2 degree Celsius for24 hours

%

≤0.07

Operating Temperature

High-low temperature chamber

degree Celsius

-50 degree Celsius～+260 degree Celsius

Thermal Conductivity

W/m/k

0.45~0.55

CTE

(typical)

-55～288 degree Celsius

(εr :2.5~2.9)

ppm/ degree Celsius

16(x)

20(y)

170(z)

CTE

(typical)

-55～288 degree Celsius

(εr :2.9~3.0)

ppm/ degree Celsius

12(x)

15(y)

90(z)

Shrinkage Factor

2 hours in boiling water

%

 0.0002

Surface Resistivity

500V

DC

Normal state

M·Ω

≥4*105

Constant humidity and temperature

≥6*104

Volume Resistivity

Normal state

MΩ.cm

≥6*106

Constant humidity and temperature

≥1*105

Surface dielectric strength

Normal state

d=1mm(Kv/mm)

≥1.2

Constant humidity and temperature

≥1.1

Dielectric Constant

10GHZ

εr

2.55±0.05, 2.62±0.05

2.75±0.05, 2.85±0.05

2.94±0.05, 3.0±0.05

Thermal Coefficient ofεr

(PPM/ degree Celsius)

-50150 degree Celsius

εr

Value

2.55

-100

2.62

-90

2.75

-90

2.85

-85

2.94

-85

3.0

-75

Dissipation Factor

10GHZ

tgδ

2.552.85

≤1.5*10-3

2.943.0

≤2.0*10-3

PIMD

2.5 GHZ

dbc

-160

UL Flammability

Rating

94 V-0