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TUC TU-872 SLK and TU-87P SLK have low Dk/Df and high thermal reliability PCB materials.
TU-872 SLK is Core and TU-87P SLK is Prepreg (PP).TU-872 SLK is based on high-performance modified epoxy resin FR-4 resin. This PCB material is reinforced with ordinary woven E glass and designed to have low dielectric constant and low loss factor, suitable for high-speed low-loss PCB and high-frequency multilayer PCB applications. TU-872 SLK PCB material is suitable for environmentally friendly lead-free process and is also compatible with FR-4 process. TU-872 SLK multilayer PCB also exhibits excellent moisture resistance, improved CTE, excellent chemical resistance, thermal stability, CAF resistance, and toughness enhanced by compounds that form an allyl network.
TUC TU-872 SLK and TU-87P SLK PCB material
TUC TU-872 SLK and TU-87P SLK Industry Approvals, PC-4101E Type Designation : /29, /99, /101, /126, IPC-4101E/126 Validation Services QPL Certified, UL Designation - ANSI Grade: FR-4.0, UL File Number: E189572, Flammability Rating: 94V-0, Maximum Operating Temperature: 130°C.
TUC TU-872 SLK and TU-87P SLK Standard Availability, Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form, Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides, Prepregs: Available in roll or panel form, Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request.
