IC Substrate - Specializing in the production of IC Substrate page 1

Product Name: Sensor IC Substrate

Material: Shengyi SI10U

Minimum width / spacing: 35 / 35um

Surface: Immersion Gold

PCB thickness: 0.25mm

Layer: 4Layers

Structure: 1L-4L,1L-2L,3L-4L

Solder mask ink: TAIYO PSR4000 AUS308

Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm

Application: Sensor IC Substrate

Model:  Component Substrate PCB

Material: CC-HL820WDI

Layers: 2layers

Thickness: 0.3mm

Resistance welding: PSR-4000 WT03

Surface treatment: Hard Gold

Minimum aperture: 0.25mm

Minimum line distance: 75um

Minimum line width: 75um

Application: Electronic components Substrate

Model:  Blind vias IC Substrate

Material: Mitsubishi Gas HF BT HL832NX

Layers: 8layers

Thickness: 0.6mm

Single size: 40 * 55mm

Resistance welding: PSR-4000 AUS308

Surface treatment: soft gold

Minimum aperture: 0.1mm

Minimum line distance: 30um

Minimum line width: 30um

Application: Blind vias IC Substrate

Model: Fingerprint card IC package substrate

Material: Shengyi SI10U

Layers: 2L

Thickness: 0.2mm

Single size: 11 * 11mm

Resistance welding: PSR-4000 AUS308

Surface treatment: Soft Gold+Hard Gold

Minimum aperture: 0.1mm

Minimum line distance: 75um

Minimum line width: 35um

Application: Fingerprint card IC package substrate

Model:  LGA package IC substrate

Material: SI165

Layers: 4L

Thickness: 0.4mm

Single size: 8 * 8mm

Resistance welding: PSR-2000 BL500

Surface treatment: ENEPIG

Minimum aperture: 0.1mm

Minimum line distance: 100um

Minimum line width: 40um

Application: LGA package IC substrate

Model:  Mini LED package substrate

Material: Doosan(South Korea)

Layers: 4layers

Thickness: 0.5mm

Single size: 1.2 * 1.2mm

Resistance welding: PSR-4000 AUS308

Surface treatment: Electric nickel silver gold

Minimum aperture: 0.3mm

Minimum line distance: 80um

Minimum line width: 30um

Application: Mini LED package substrate

Model:  eMMC Package Substrate

Material: HL832NS

Layers: 4L

Thickness: 0.21mm

Single size: 11.5 * 13mm

Resistance welding: PSR-4000 AUS308

Surface treatment: Soft Gold

Minimum aperture: 0.1mm

Minimum line distance: 20um

Minimum line width: 20um

Application: eMMC Package Substrate PCB Board

Model:  BGA IC Substrate Board

Material: HL832NXA

Layers: 2L

Thickness: 0.2mm

Single size: 35 * 25mm

Resistance welding: PSR-4000 AUS308

Surface treatment: Soft Gold

Minimum aperture: 0.1mm

Minimum line distance: 30um

Minimum line width: 30um

Application: BGA package IC Substrate PCB Board

Product Name: SiP Package Substrate

Material: Shengyi SI10U

Layers: 6L

Thickness: 0.5-0.6mm

Single size: 35 * 35mm

Resistance welding: PSR-4000 AUS308

Surface treatment: ENEPIG

Minimum aperture: 0.075/0.1mm

Minimum line distance: 30um

Minimum line width: 50um

Application: SiP package IC Substrate PCB Board

Product Name: 4-layers DDR Substrate Board

Material: Mitsubishi Gas Chemical HL832

Layers: 4L

Thickness: 0.25mm

Copper thickness: 0.5oz

Color: Green (AUS308)

Surface treatment: Soft Gold

Minimum aperture: 100um

Minimum line distance: 75um

Minimum line width: 50um

Application: IC substrate board

Model:  HDI IC Substrate Board

Material: SI10U

Layers: 6L(2+2+2)

Thickness: 0.6mm

Single size: 35 * 35mm

Resistance welding: PSR-4000 AUS308

Surface treatment: ENEPIG

Minimum aperture: 0.1mm

Minimum line distance: 70um

Minimum line width: 30um

Application: HDI IC Substrate Board

Product Name:BGA IC substrate

Plate:Mitsubishi Gas HF BT HL832NX-A-HS

Minimum width / spacing:30 / 30um

Surface:ENEPIG(2U)

PCB thickness:0.3mm

Layer:4Layers

Structure:1L-4L,1L-2L,3L-4L

Solder mask ink:TAIYO PSR4000 AUS308

Aperture:Laser hole 0.075mm, Mechanical hole 0.1mm

Application:BGA Circuit Board