Multi-layer circuit boards contain multiple types of working layers, such as: protective layer, silk screen layer, signal layer, internal layer, etc. How much do you know about these layers? The functions of each layer are different, let us Let's understand what the functions of all levels are!
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Protection layer: used to ensure that the parts of the circuit board that do not need to be tinned are not tinned, and the PCB circuit board is made to ensure the reliability of the circuit board operation. Among them, Top Paste and Bottom Paste are the top solder resist layer and the bottom solder resist layer, respectively. Top Solder and Bottom Solder are the solder paste protective layer and the bottom solder paste protective layer, respectively.
Multi-layerPCB circuit board and the meaning of each layer are introduced in detail
Silk screen layer-used to print the serial number, production number, company name, logo pattern, etc. of the components on the circuit board.
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Signal layer-used to place components or wiring. Protel DXP usually contains 30 middle layers, namely Mid Layer1~Mid Layer30. The middle layer is used to arrange signal lines, and the top and bottom layers are used to place components or deposit copper.
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Internal layer-used as a signal wiring layer, Protel DXP contains 16 internal layers.
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Professional PCB manufacturers all PCB materials must be carefully reviewed by the engineering department before they are produced. The pass-through rate of each board is as high as 98.6%, and all products have passed the RROHS environmental certification and the United States UL and other related certifications.
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The first-order is relatively simple, and the process and craftsmanship are well controlled.
The second order started to be troublesome, one was the alignment problem, and the other was the problem of punching and copper plating. There are many second-order designs. One is that the positions of each step are staggered. When connecting the next adjacent layer, it is connected in the middle layer through a wire, which is equivalent to two first-order HDIs. The second is that the two first-order holes overlap, and the second-order is achieved by superposition. The processing is similar to two first-order, but there are many process points to be specially controlled, which is mentioned above. The third type is to punch directly from the outer layer to the third layer (or N-2 layer). The process is different from the previous one, and the difficulty of punching is also greater.
For the third-order analogy, it is the second-order analogy.
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