Microwave Tech - Design and skills of high-frequency board wiring

Design and skills of high-frequency board wiring

High-frequency circuits tend to have high integration and high wiring density. The use of multi-layer boards is not only necessary for wiring, but also an effective means to reduce interference. In the PCB Layout stage, a reasonable selection of the printed board size with a certain number of layers can make full use of the intermediate layer to set up the shield, better realize the nearest grounding, and effectively reduce the parasitic inductance and shorten the signal transmission length, while still maintaining a large All of these methods are beneficial to the reliability of high-frequency circuits, such as the amplitude reduction of signal cross-interference. With the same material, the noise of the four-layer board is 20dB lower than that of the double-sided board. However, there is also a problem. The higher the number of PCB half-layers, the more complex the manufacturing process, and the higher the unit cost. This requires that in addition to selecting the appropriate number of layers of PCB boards, reasonable The layout plan of the components and parts, and adopt the correct wiring rules to complete the design.

1. The fewer lead layers alternate between the pins of high-frequency circuit devices, the better

2. The shorter the lead between the pins of the high-frequency circuit device, the better

3. The fewer lead bends between the pins of high-speed electronic devices, the better

4. Pay attention to the "crosstalk" introduced by signal lines in parallel with close distances

5. Isolate the ground wire of high-frequency digital signal and analog signal ground wire

6. Add high-frequency decoupling capacitor to the power supply pin of the integrated circuit block

7. Avoid loops formed by wiring

8. Good signal impedance matching must be guaranteed

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