Electronic Design - PCB manufacturers: how to reduce noise and electromagnetic interference

PCB manufacturers: how to reduce noise and electromagnetic interference

The following are 24 tips to reduce noise and electromagnetic interference in PCB design, summarized after years of design:

1. Keep the clock, bus, and chip selection signals away from I/O lines and connectors.

2. The analog voltage input line and reference voltage terminal should be as far away as possible from the digital circuit signal line, especially the clock.

3. The key line should be as thick as possible, and protective ground should be added on both sides. The high-speed line should be short and straight.

4. Lines sensitive to noise should not be parallel to high-current, high-speed switching lines.

5. Do not route wires under the quartz crystal or under noise-sensitive devices.

6. Do not form a loop on the signal. If it is unavoidable, make the loop area as small as possible.

7. One decoupling capacitor for each integrated circuit. A small high-frequency bypass capacitor must be added to each electrolytic capacitor.

8. Use large-capacity tantalum capacitors or juku capacitors instead of electrolytic capacitors for circuit charging and discharging energy storage capacitors. When using tubular capacitors, the case should be grounded.

9. For A/D devices, the digital part and the analog part would rather be unified than crossed.

10. Low-speed chips can be used instead of high-speed chips. High-speed chips are used in key places.

11. A resistor can be connected in series to reduce the jump rate of the upper and lower edges of the control circuit.

12. Try to provide some form of damping for relays, etc.

13. Do not leave the input terminal of the unused gate circuit open. The positive input terminal of the unused op amp is grounded, and the negative input terminal is connected to the output terminal.

14. For printed boards, try to use 45-fold lines instead of 90-fold lines to reduce the external emission and coupling of high-frequency signals.

15. The printed boards are partitioned according to frequency and current switching characteristics, and the noise components and non-noise components should be farther apart.

16. Use single-point power supply and single-point grounding for single and double panels. The power line and ground line should be as thick as possible. If the economy is affordable, use a multilayer board to reduce the capacitive inductance of the power supply and ground.

17. For weak signal circuits, do not form current loops around low-frequency circuits.

18. The I/O drive circuit should be as close as possible to the edge of the printed board, so that it can leave the printed board as soon as possible. The signal entering the printed board should be filtered, and the signal from the high-noise area should also be filtered. At the same time, a series of terminal resistors should be used to reduce signal reflection.

19. The useless end of the MCD should be connected to high, or grounded, or defined as the output end. The end of the integrated circuit that should be connected to the power supply ground should be connected, and do not float.

20. The clock line perpendicular to the I/O line has less interference than the parallel I/O line, and the clock component pins are far away from the I/O cable.

21. The component pins should be as short as possible, and the decoupling capacitor pins should be as short as possible.

22. Use the lowest frequency clock that meets the system requirements.

23. The clock generator is as close as possible to the device using the clock. The shell of the quartz crystal oscillator should be grounded.

24. Enclose the clock area with a ground wire and keep the clock wire as short as possible.

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