Standard PCB - Cheap FR-4 PCB manufacturing page 2

Model :  44layers IC Probe Card PCB

Material :  TUC/TU872HF

Layer :  44Layers

Color : Green

Size: 20 "* 22"

Structure: L1-L44 10mil

                 L1-L28    12mil

                 L29-L44  14mil

Surface technology: hard gold 3-15u

Special process: metal cladding, depth control drilling

Application : IC(Integrated Circuit Chip) test PCB

Model : IC Chip Test PCB

Material :  TU872SLS

Layer :  20Layers

Color : Green/White

Finished Thickness :  2.0mm

Copper Thickness :  1OZ

Surface Treatment :  Immersion Gold

Surface treatment : deposited gold ≥ 3U“

Application : IC(Integrated Circuit Chip) Test PCB

Model :  Wireless Charging PCB

Material :  S1000-2

Layer :  6Layers

Color : Green/White

Finished Thickness :  1.2mm

Copper Thickness :  2OZ

Surface Treatment :  Immersion Gold

Surface treatment : deposited gold ≥ 2U“

Copper thickness in hole : 35UM

Minimum aperture: 0.4mm

Application : Wireless charging PCB

Model :  Computer Graphics Card PCB

Material :  S1141

Layer :  6Layers

Color : Black/White

Finished Thickness :  1.2mm

Copper Thickness :  1OZ

Surface Treatment :  Immersion Gold + Gold Finger

Min Trace :  3mil(0.075mm)

Min Space :  3mil(0.075mm)

Characteristic : Gold finger electroplating hard gold

Application : Computer graphics card PCB

Model :  Communication Base Station PCB

Material :  TU883

Layer :  16Layers pcb

Color : Green/White

Finished Thickness :  1.8mm

Copper Thickness :  1OZ

Surface Treatment :  Immersion Gold

Min Trace :  4mil(0.1mm)

Min Space :  4mil(0.1mm)

Application : bCommunication base station PCB

Model :Resin Plug PCB

Layers : 6Layers 

Material : S1141

Finished Thickness：1.2mm

Copper Thickness : 1/0.5OZ

Color : Green/White

Surface treatment: immersion gold

Special technology: resin plug

Min Trace / Space：BGA 3mil/3mil

Application : Digital products

Model :  Fibre-Optical Module PCB

Material :  MEGTRON 6(Panasonic M6)

Layer :  8Layers

Color : Green/White

Finished Thickness :  1.0mm

Copper Thickness :  1OZ

Surface Treatment :  Immersion Gold+Gold finger

Min Trace :  4mil(0.1mm)

Min Space :  4mil(0.1mm)

Product features: impedance 100 ± 7%; 50 ± 10%; speed: 400g; tolerance between gold finger and plate edge: ± 0.05mm

Application : fibre-optical module pcb

Model : Surveillance Camera PCB Board

Material : SY S1000-2 TG170 FR4

Layer : 6Layers

Copper Thickness : 1OZ

Finished Thickness : 1.2mm

Surface Treatment : Immersion Gold

Trace/Space : 3mil/3mil(0.075MM/0.075MM)

Min Hole : 0.2mm(8mil)

Special Process : Blind and buried vias

Layer structure : 1-2,5-6,7-12

Application : Surveillance Camera PCB Board

Model : 10L Blind & Buried Hole

Material : FR4

Layer : 10Layers

Copper Thickness : 1OZ

Finished Thickness : 1.6mm

Surface Treatment : Immersion Gold

Trace/Space : 2.5mil/2.5mil

Min Hole : 0.2mm(8mil)

Special Process : Blind and buried vias

Application : Digital PCB

Model : Blind and Buried Vias PCB

Material : High TG FR4

Layer : 12Layers

Copper Thickness : 1OZ

Finished Thickness : 1.6mm

Surface Treatment : Immersion Tin

Trace/Space : 4mil/4mil(0.1MM/0.1MM)

Min Hole : 0.2mm(8mil)

Special Process : Blind and buried vias

Layer structure : 1-2,1-3,4-6,7-12

Application : Security Control pcb

Model : 16L Blind Vias Backplane PCB

Material : High TG FR4

Layer : 12Layers

Copper Thickness : 1OZ

Finished Thickness : 1.6mm

Surface Treatment : Immersion Tin

Trace/Space : 4mil/4mil(0.1MM/0.1MM)

Min Hole : 0.2mm(8mil)

Special Process : Blind and buried vias

Layer structure : 1-2,1-3,4-6,7-12

Application : Security Control PCB

Model : Gold Finger Blind Hole PCB

Material :  S1140 FR4

Layer : 4Layers

Copper Thickness : 1OZ

Finished Thickness : 1.2mm

Surface Treatment : Immersion Gold

Trace/Space : 4mil/4mil(0.1MM/0.1MM)

Min Hole : 0.2mm(8mil)

Special Process : Blind and buried vias

Special process : Gold finger + blind hole

Application : Computer component pcb