Model : 16L Blind Vias Backplane PCB
Material : High TG FR4
Layer : 12Layers
Copper Thickness : 1OZ
Finished Thickness : 1.6mm
Surface Treatment : Immersion Tin
Trace/Space : 4mil/4mil(0.1MM/0.1MM)
Min Hole : 0.2mm(8mil)
Special Process : Blind and buried vias
Layer structure : 1-2,1-3,4-6,7-12
Application : Security Control PCB
Backplane PCB, also known as motherboard PCB, is a kind of substrate, which is responsible for carrying the function PCB including daughter PCB or line card. The main task of the backplane is to carry the daughter PCB and distribute the power to the function PCB, so as to realize the electrical connection and signal transmission. Therefore, the system function can be obtained through the cooperation between the backplane and its daughter PCB.
With the increasing integrity of IC (integrated circuit) components and the increasing number of I / O, as well as rapid progress, in the development of electronic assembly, high-frequency signal transmission and high-speed digitization, the functions of backplane gradually cover the bearing, signal transmission and distribution of functional boards. In order to achieve these functions, the backplane must meet higher requirements in the number of layers (20 to 60 layers), plate thickness (4 mm to 12 mm), number of through holes (30 000 to 100 000), reliability, frequency and signal transmission quality.
Model : 16L Blind Vias Backplane PCB
Material : High TG FR4
Layer : 12Layers
Copper Thickness : 1OZ
Finished Thickness : 1.6mm
Surface Treatment : Immersion Tin
Trace/Space : 4mil/4mil(0.1MM/0.1MM)
Min Hole : 0.2mm(8mil)
Special Process : Blind and buried vias
Layer structure : 1-2,1-3,4-6,7-12
Application : Security Control PCB
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