Model : ATE test chip PCB
Material : isola 370hr
Layer : 12Layers
Color : Green
Board Thickness: 3.0mm
Surface technology: Immersion Gold(5U)
Copper thickness: inner layer 2OZ, outer layer 1OZ
Application : ATE chip test PCB
We call the IC test chip equipment ATE (automatic test equipment), and the PCB used in ATE is called ATE test chip PCB. Generally, a large number of ATE test functions are gathered together, and ate is controlled by computer to test the functionality of semiconductor chips, which includes the combination of software and hardware.
This starts with the process of semiconductor design and manufacturing.
A semiconductor product has to go through three industrial processes: IC design, wafer manufacturing and packaging.
All test chip products need two key test nodes:
Chip probing (CP): ate is called probe stage in this stage
Final test (FT for short)
The chip is tested after packaging, and different chip types have different test methods and requirements.
Chip type:
Analog: simulation is a concept that you can talk about slowly. In short, it's the interface to perceive the physical world. In terms of signal characteristics, the analog signal is continuous
Digital chip: the use of digital signals to transmit data information, such as microprocessors. In terms of signal characteristics, it is discrete. As shown in the figure below
Mixed signal chip: naturally, there are two kinds of signals, and various functions are integrated. Like DSP and SOC chips.
Memory / high speed bus chip: the test project of this kind of chip is relatively more complex, and has special test requirements on its own product characteristics.
What is the system for chiptest?
Tester, DIB / probe card, handler, test software (there are different languages and modules according to different types of machine for engineers to develop)
chiptest
test chip
How does the test system work in general?
First of all, the chip testing machine generates a set of signals according to the requirements of the test program, which is generally very simple.The pattern is input into the chip to be tested, and the chip transmits the output value to the ate machine according to the input and its own function. The machine compares the output value with the chip according to the pre programmed test standard.
If it meets the requirements, it will pass; otherwise, it will fail. Of course, there is a tolerance value for the standard, otherwise the failure pile, such a strict pass rate, the design engineer is estimated to be crazy. However, in this difference range, you can continue to do binning tests to grade the products.
Finally, the test program tests our chip by changing different voltage, current and timing, and then debugging and characterization.
Taking memory IC as an example, the test items are generally DC to AC parameter test plus functional test
DC parameter test includes signal pin's open / short, VCC pin's open / short, standby and ICC current and leakage test in operation.
AC parameter test mainly comes from TCAC (column access time) test
For timing test: setup time, hold time, propagation delay and timing calibration
The common application scope of the testing machine is as follows:
Memory IC
ADVANTEST t55xx series
ADVANTEST t53xx series
Nexttest magnum series
Credence Kalos
Verigy V4000 series
Verigy v5000 series
Verigy v93000 HSM series
KingTiger KT2/ KT3
Digital, mixed signal or SOC chip
Teradyne tiger series
Teradyne Flex / Ultra flex series
Teradyne J750 series
Teradyne catalyst series
Credence Sapphire
Credence quarter / duo series
Credence sapphire D series
Credence SC series
Schlumberger exa 2x00 series
Verigy v93000 SOC series
Agilent 94000 series
LTx fusion series
Advantage t77xx series
ADVANTEST T2000 series
ADVANTEST t65xx / t67xx series
LCD Driver
Yokokawa ts67xx series
ADVANTEST t63xx series
Spea C3320
RF chip
Credence asl-3000 series
LTx fusion CX series
Agilent 84000 series
Advatest T7611
Roos Instrument 7100A
Next, let's look at the functional test section
Read Cycle
Wrtie Cycle
Fast Page Mode/ EDO Mode Check
March Column/ March Row
On this basis, special function test items can be added
Checkboard
Butterfly
Diagonais
Moving Inversion
Memory test has its own particularity, but it is the same as other types of ATE test chip in composition. No more than contact / continuity test (open / short), DC parameter test, AC timing test, digital function test and mixed signal test.
Model : ATE test chip PCB
Material : isola 370hr
Layer : 12Layers
Color : Green
Board Thickness: 3.0mm
Surface technology: Immersion Gold(5U)
Copper thickness: inner layer 2OZ, outer layer 1OZ
Application : ATE chip test PCB
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