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Rogers ULTRALAM3850 laminate circuit material uses high-temperature resistant liquid crystal polymer (LCP) as the dielectric film. These products are specially developed for single-layer and multi-layer substrate structures. These tack-free laminates are ideal for high-speed and high-frequency applications in communications networking equipment, high-speed computer data links, and other high-performance applications.
ULTRALAM 3850 circuit material has a low and stable dielectric constant and dielectric loss, which are key requirements for high-frequency PCB and high-speed PCB.
ULTRALAM 3850 is available as a dual copper clad laminate.
Panel provided. It can be used in multilayer structures to bond films with ULTRALAM 3908.
ULTRALAM 3000 laminate UL file number is E122972
Model: ULTRALAM 3000, ULTRALAM 3850, ULTRALAM 3850(HT), ULTRALAM3908
Category: microwave circuit board materials, liquid crystal polymer circuit materials
Applications: Locomotive, Rail Transit, Electricity, Renewable Energy, Body and Chassis, Lighting, Equipment, and Inverter Power, Defense Industrial Equipment, Vehicle, Vehicle Communication, Vehicle Entertainment, Vehicle Networking, Industrial Automation, Industrial Servo, Indoor Lighting, Intelligence Home Furnishing, Industrial Equipment Control, Cell Phone Related, Electric Vehicle Powertrain, Communication Equipment, Internet of Things, Warehousing, Security Systems, High-Speed Switches and Routers, Hybrid Substrates, Chip Packaging, Handheld, and RF Devices, Memory, Base Station Antennas, Military Satellites, radar sensors, High-Speed Rigid-Flex PCB Boards, Microwave ICs/ICs, Mobile Phone/Tablet Antennas, Hybrid Substrates, Automotive Radar, Mobile Phone/Tablet High-Speed Cables, All LCP Flexible Connections, High-Speed Switches and Routers, Backplane Interplane, Data Transmission Lines, Board-to-Board, Mixed-Dielectric Layers, Handheld, and RF Devices.
Safety/Environmental Specifications: Halogen-free, UL94VTM/0
Rogers ULTRALAM3850HT
The dielectric material used in Rogers ULTRALAM3850HT laminates has a melting temperature of 330C, which simplifies the multi-layer build process and increases throughput. ULTRALAM 3850HT laminate circuit material from Rogers Corporation uses high-temperature liquid crystal polymer (LCP) as the dielectric film. These products are specially developed for single-layer and multi-layer substrate structures. These adhesive-free laminates are ideal for high-speed and high-frequency applications in mobile internet devices (phones/tablets), automotive radar, moisture-sensitive microwave monolithic integrated circuits, and chip packaging applications.
ULTRALAM 3850HT circuit material features low and stable dielectric constant, dielectric loss, and copper loss, a key requirement for high frequency, high-speed products. ULTRALAM 3850HT is a dual copper clad laminate. It can be used in multilayer structures to bond films with ULTRALAM 3908.
Rogers ULTRALAM3908
Rogers ULTRALAM 3908 Dielectric Bond Sheet can be used as the bonding medium (bond layer) between copper and dielectric layers. This product is specially designed for multilayer board dielectric construction. This non-adhesive film is very suitable for high-speed and high-frequency applications and other commercial performance applications in communication network equipment and computer data transmission lines.
ULTRALAM 3908 Dielectric Bond Sheet has the low and stable dielectric constant required by commercial-speed commercial-frequency circuits. This product can be used with Rogers ULTRALAM 3000 family of LCP circuit materials such as ULTRALAM 3850HT double-sided laminate in multilayer circuit structures.
The combination of ULTRALAM 3850HT circuit material and ULTRALAM 3908 adhesive film enables completely adhesive-free, all-LCP multilayer circuit constructions.
If ULTRALAM3850 uses ULTRALAM3908 as the prepreg, the maximum number of layers of the laminate does not exceed 7 layers; if other types of prepregs are used, such as 2929, 3001, etc., more layers can be achieved.
Rogers' ULTRALAM3000 circuit material is a thermal film crystalline polymer that provides excellent high-frequency performance within a very thin dielectric. The material possesses low moisture absorption and good dimensional stability. The ULTRALAM3000 liquid crystal dielectric board is ideal for high-frequency miniaturization applications, sensors, antennas, and high-speed flip-chip designs. The ULTRALAM3000 circuit material family includes ULTRALAM3850 (HT) laminates and ULTRALAM3908 bonding sheets, which together form a multilayer board structure.
The ULTRALAM3850 laminate circuit board uses a high-temperature resistant LCP (Liquid Crystal Polymer) as the dielectric layer, and since it is adhesive-free, it is especially suitable for high speed and high-frequency applications with single or multi-layer dielectric structures, such as telecommunication networks devices, high-speed routers, high-speed data connections, and other high-performance applications. The ULTRALAM3850 has a low and stable dielectric constant and dielectric loss, which are core requirements for high-speed, high-frequency products. ULTRALAM3850 can provide double-sided copper-clad laminates in sheet form. ULTRALAM 3850 and 3850HT laminates use very thin copper to achieve good line etch capabilities.
Solid dimensional stability and excellent high-frequency performance are one of the core strengths of the ULTRALAM 3850. The easy bending properties of the material make it ideal for conformal and bending applications, and dimensional stability allows for greater design flexibility while maximizing circuit density. The stable electrical performance of ULTRALAM 3850 allows tight control of impedance matching, excellent thickness uniformity to maximize signal integrity, and the use of thinner dielectric layers to minimize signal distortion. Water absorption of less than 0.04% allows the ULTRALAM 3850 material to maintain stable electrical, mechanical and dimensional properties in wet environments, while also reducing bake time. Safety characteristics are also one of the considerations for laminate selection. ULTRALAM 3850 laminate is halogen-free and complies with WEEE (Waste Electrical and Electronic Equipment Directive). In terms of flame retardant properties, it has passed UL94VTM/0 and meets the flame retardant requirements of commercial products.
ULTRALAM3908 adhesive sheet can be used for the bonding medium (adhesion layer) between the copper foil and dielectric material and was specially developed for multi-layer board construction. The low and stable dielectric constant of the ULTRALAM3908 adhesive sheet is ideal for high-frequency PCB and high-speed PCB material applications. This material can be combined with other ROGERS ULTRALAM3000 LCP circuit material families for the design of multilayer board structures. ULTRALAM3908 adhesive sheet meets the requirements of IPC4203/TBD.
The ULTRALAM3000 liquid crystal dielectric plate has a very low and stable dielectric constant (2.9). The coefficient of variation of the dielectric constant with temperature is a key parameter because the materials used in microwave applications are often used in outdoor or even space environments, and a very stable dielectric constant can ensure that the material works normally at various temperatures. The permittivity determines the speed at which an electrical signal propagates in the medium. The lower the dielectric constant, the faster the signal transmission. The low dielectric constant of ULTRALAM3000 reduces signal propagation delay.
Dielectric loss is also an important parameter that affects the electrical properties of materials because when a high-frequency signal passes through the dielectric layer, the change in frequency makes the molecules move continuously, generating a large amount of heat, resulting in energy loss. The smaller the dielectric loss, the smaller the signal loss. The low dielectric loss of ULTRALAM3000 liquid crystal dielectric material can meet the needs of high-speed signals.
ULTRALAM3000's excellent high-frequency performance, robust dimensional stability, extremely low moisture absorption (<0.04% by weight), and flame retardancy make it ideal for high-frequency miniaturized devices. High-speed LCP interconnection, MMIC packaging, and hybrid substrates are typical applications. High-performance devices such as high-speed switches and routers, military satellite and radar sensors, hybrid substrates, mobile phones, and base station antennas are also widely used for ULTRALAM3000. In addition, the material can be used with ROGERS RO4450B series adhesive sheets, and R/flex CRYSTAL7200 adhesives and can be mixed with other types of epoxy, acrylic, cyanate, or PTFE resins to strengthen multiple performances of the laminate.
