1. SMT patch preparation work of PCBA processing plant
From the sample to mass production stage of SMT patch processing in PCBA processing plants, we need to make sufficient pre-production preparations to ensure that all materials can go online smoothly and avoid the occurrence of various stopped materials. Because production efficiency is the lifeline of PCBA processing plants.
From the sample to mass production stage of SMT patch processing in PCBA processing plants, we need to make sufficient pre-production preparations to ensure that all materials can go online smoothly and avoid the occurrence of various stopped materials. Because production efficiency is the lifeline of PCBA processing plants. In order to make pre-natal preparations, fully effective, and ensure timely completion, standardized production process management is particularly important. The pre-production preparation must be done for the SMT chip processing and manufacturing of the PCBA processing plant.
1. Engineering
1. After the planned order is released, the preparation shall be arranged 4 hours in advance: steel mesh, fixture review, materials, procedures, special requirements for materials follow-up, and samples are completed.
2. The order needs to be tested after SMT production, and the first finished product to be tested on the same day will be arranged.
3. Propose a temporary operation plan 1 hour before the production of poorly tested and malfunctioning products, and propose specific operation and production measures within 1 day.
2. Production
SMT patch processing:
1. According to the planned order, extend the material 4 hours in advance and prepare the material.
2. The technician confirms that the steel mesh, tools, and data (procedures) are complete 2 hours before the transfer.
3. There is little material for the online production of the tail board, the technical staff is responsible for the docking of the material personnel, and the department director will follow up and complete the supplementary materials within 30 minutes.
4. Visually inspect 5PCS after the middle inspection furnace, and the defect is more than 5%, report to the technician, and the supervisor will analyze and deal with it.
DIP plug-in processing:
1. Stretching is scheduled 4 hours in advance according to the planned order, and the first piece, quality, and engineering confirmation are made.
2. Determine the auxiliary materials before the extension of 4 hours: furnace tools, welding tools, tools, customer tools, etc.
3. Extend the prenatal meeting (for each product) and complete it within 3~5 minutes of the technical and quality instructions.
4. The test failure reaches 5%, the production staff report is extended, the supervisor will also analyze the project at the same time, reply to the specific plan within one hour, production execution, and complete quality supervision.
3. Quality
1. SMT's first IPQC online production of DIP, IPQC confirm the first inspection, and assist the production to be completed 2 hours in advance.
2. Testing and assembly: Production and engineering are ordered as planned, and the quality is provided 4 hours in advance, and the IPQC is confirmed for the first time and completed within 2 hours before the production line.
Fourth, the current process: all products that need to be tested and burned
New order-SMT-engineering test-DIP-test-assembly.
Return-SMT-DIP (production trial)-test-assembly.
Five, the new process (optimization)
1. Return order for production and online programming and testing Return order-SMT-AOI-DIP (production trial production first)-test-assembly.
2. After ordering SMT chips, all DIP primary material production preparations will be arranged for welding, testing, and assembly engineering leading arrangements on the same day. New order-SMT-AOI-engineering trial production first-DIP-test-assembly.
2. What are the elements in the SMT patch processing process?
SMT patch refers to a series of processing processes based on PCB. It is a very common technology and process in the electronic assembly industry. So do you know what are the constituent elements of smt patch processing technology?
SMT patch refers to a series of processing processes based on PCB. It is a very common technology and process in the electronic assembly industry. So do you know what are the constituent elements of smt patch processing technology?
One is silk screen, which can also be called glue dispensing. The function of this factor is to stick the solder paste or smt patch on the pad of the PCB in order to prepare for the soldering of the component. The screen printing equipment that needs to be used is the screen printing machine, and the smt patch production line is at the forefront.
Second, dispensing. Its main function is to fix the components on the plate. The equipment needed is a glue dispenser, which is located at the front or back of the smt patch production line, or it can be a testing device.
There is also placement, which we call curing. To accurately install the surface mount components to the fixed position of the PCB, the equipment required for this step is the placement machine. This product is located behind the smt patch production line.
The fourth is reflow soldering. The effect is to melt the solder paste, so that the surface-mounted components can be bonded to the PCB board. What you need to use is a reflow oven, located behind the placement machine. The fifth step is to clean the smt patch. First of all, it is necessary to clean the welding slag that is harmful to the human body on the assembled welding plate. The cleaning machine used is this kind of equipment, and the position does not need to be fixed.