PCB Technical - The equipment needed for PCB and the type of SMT solder paste

1. Commonly used circuit boards need to be coordinated by several devices

Complete the assembly task at the same time. After optimizing the variety selection, path setting, position coordinates and other factors of the single device placement component, the rhythm of the connection of several devices should be considered to avoid the suspension of the entire production line. The production should be based on different process requirements., Implement accurate process plans, and continue to improve in production. Several common SMT production process plans are as follows:

1) Single-sided mounting process

2) Double-sided mounting process

3) Single-sided mixed

4) Double-sided mixed

3. Several steps to strengthen SMT equipment governance

1. SMT line construction plan design

The principle of line construction: shared use, economy, and expandability.

To combine the purpose of SMT use, the nature and type of products produced, consider the size and accuracy of the components and ICs used in the product, the type and number of components, the size of the P board required by the product, the scale of production, and the quality level requirements of the batch. To determine the device model.

According to the product process requirements, combined with the possible process plans of different types of products, determine the function and configuration of the SMT equipment.

Scalability must be considered. Because the electronic products and their supporting components industries are developing very fast, SMT equipment must leave room for system functions, accuracy, index expansion and production capacity improvement. Choosing the latest equipment and purchasing all the options at once will inevitably result in excessive investment and many options.

pieces of unsuitable use have been left idle for many years, resulting in a large amount of capital under pressure and poor economy. To build an SMT production line with complete supporting facilities and strong capabilities, with a large investment amount and a short equipment replacement cycle, some small and medium-sized enterprises have to bear commensurate problems. If the application effect is not good for a company that is determined to purchase, it will bring a heavy burden to the company. Therefore, when designing the construction line, the choice of economical use is a commensurate hub. The high-speed machine is fast and powerful, but the price is about 2 to 3 times that of the medium-speed machine. If the type of product produced is not small in variety and produced in large quantities, several medium-speed generator lines can be selected, which can solve the problem of large investment funds at one time, and small funds can be used many times.

Investment, a flexible way to increase production capacity. After the equipment fails, the impact will be minimized. The payback period of equipment investment is preferably 2-3 years.

2. What are the types of solder paste for SMT patch processing?

What are the types of solder paste for SMT chip processing? In the process of smt patch processing, solder paste is often used, but there are various types of solder paste. This is the need to choose solder paste according to the product being processed. The following editor will tell you about this aspect. .

Jingbang SMT chip processing

1. Leaded solder paste and lead-free solder paste

The lead solder paste contains lead, which is harmful to the environment and human body, but it has good soldering effect and low cost. It can be applied to some electronic products that do not require environmental protection. Lead-free solder paste contains only a small amount of lead, which is less harmful to the human body. It is an environmentally friendly product and is used in environmentally friendly electronic products. Foreign customers will require the use of lead-free solder paste for production.

Two, high temperature solder paste, medium temperature solder paste, low temperature solder paste

1. High-temperature solder paste refers to the lead-free solder paste that is usually used. Its melting point is generally above 217°C and the soldering effect is good.

2. Medium temperature solder paste. The commonly used lead-free medium temperature solder paste has a melting point of about 170°C. The main feature of the medium temperature solder paste is the use of imported special rosin, which has good adhesion and can effectively prevent collapse.

3. The melting point of the low-temperature solder paste is 138 degree Celsius, and the low-temperature solder paste mainly contains bismuth. When the components of the patch cannot withstand the temperature of 200 degree Celsius and above and the reflow process is required, use the low-temperature solder paste for the soldering process. It protects the original components and PCB that cannot withstand high temperature reflow soldering, and is very popular in the LED industry.

3. Tin powder particle size

According to the particle diameter of the tin powder, the solder paste can be divided into 1, 2, 3, 4, 5, and 6 grades of solder paste. Among them, the 3, 4, and 5 powders are the most commonly used.

The more precise the product, the smaller the tin powder needs to be, but the smaller the tin powder, the corresponding increase in the oxidation area of the tin powder. In addition, the shape of the tin powder is round, which helps to improve the quality of printing.

The higher the difficulty of SMT chip processing, the more important the selection of solder paste. Only the solder paste suitable for product requirements can effectively reduce the quality defects of solder paste printing, improve the quality of reflow soldering, and reduce the cost of production.