SMT placement machines are mainly used in industry, and they are the most widely used in the electronics industry. So what are the processes for SMT placement machines? What are the effects? Do you understand? Let the SMT processing factory answer it for everyone, let’s take a look! Hope it helps you.
SMT chip placement machine processing is a series of process technology that is processed on the basis of PCB. It has the advantages of high placement accuracy and fast speed, and has been adopted by many electronic manufacturers. The SMT placement machine processing process mainly includes screen printing or dispensing, placement or curing, reflow soldering, cleaning, inspection, rework, etc., and multiple processes are carried out in an orderly manner to complete the entire placement process. The following Dipeng technicians will mainly organize and introduce the technological process and function of SMT placement machine processing.
SMT placement machine processing production line
1. Screen printing: The front-end equipment of the SMT production line is a screen printing machine. The main function is to print solder paste or patch glue onto the PCB pads to prepare for the soldering of components.
2. Dispensing: The equipment located at the forefront of the SMT production line or behind the inspection machine is a dispensing machine. Its main function is to drip glue onto the fixed position of the PCB, and the purpose is to fix the components on the PCB.
3. Placement: The equipment behind the screen printer in the SMT production line is a placement machine, whose function is to accurately install surface mount components on a fixed position on the PCB.
4. Curing: The equipment behind the placement machine in the SMT production line is a curing oven, whose main function is to melt the patch glue, so that the surface mount components and the PCB board are firmly bonded together.
5. Reflow soldering: The equipment behind the placement machine in the SMT production line is a reflow soldering furnace. Its main function is to melt the solder paste and make the surface mount components and the PCB board firmly bonded together.
6. Inspection: In order to ensure the welding quality and assembly quality of the assembled PCB board, it needs to use magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection The main function of the system and other equipment is to detect whether the PCB board has defects such as false soldering, missing soldering, and cracks. These equipments can be placed in suitable places on the production line according to the testing needs.
7. Repair: detect the faulty PCB board and need to be repaired. Generally use a soldering iron or a rework station for processing. Can be configured at any position in the production line.
8. Cleaning: There may be solder residues harmful to the human body on the assembled PCB board, such as flux, etc., which need to be cleaned up with a cleaning machine. The location of the washing machine can be not fixed, it can be online or offline.
The above content is about the technological process and function of SMT placement machine processing, I believe everyone has already understood. SMT placement machine processing equipment used by different manufacturers is different, but the production process is similar, mainly the above eight process specifications.