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1. Plate material: FR-4, CEM-3, which are common double-sided PCB and multi-layer PCB plates. Its price is also related to the thickness of the board and the thickness of copper and platinum in the middle of the board, while FR-I, CEM-1 These are our common single-board materials, and the price of this material is also very different from the above double-sided, multi-layer boards.
2. It is the thickness of the sheet, and its common thickness is 0.4, 0.6, 0.8, 1.0, 1.2, 1.5, 1.6, 2.0, 2.4, 3.0, 3.4, and the thickness and price of our conventional plates are not very different.
3. The thickness of copper and platinum will affect the price. The thickness of copper and platinum is generally divided into: 18(2/1OZ), 35(1OZ)70(2OZ), 105(3OZ), 140(4OZ) and so on.
4. Suppliers of raw materials, the most common and commonly used ones are: Shengyi \ Jiantao \ International, etc.
Process cost:
1. It depends on the circuit on the PCB. If the wire density is thin (below 4/4mm), the price will be calculated separately
2. There is also BGA on the board, so the cost will rise relatively, and in some places, how much is BGA?
3. It depends on the surface treatment process. Our common ones are: spray lead tin (hot air leveling), OSP (environmental protection board), spray pure tin, tin, silver, gold, etc. Of course, the surface technology is different. The price will also be different.
4. It depends on the process standard; what we commonly use is: IPC2, but some customers require higher requirements, (for example, Japanese) Our common ones are: IPC2, IPC3, enterprise standard, military standard, etc., of course, the higher the standard, The price will be higher.
Every PCB sold in the PCB industry is customized by customers. Therefore, the quotation of the PCB board needs to be cost-calculated first. At the same time, it also needs to refer to the automatic layout calculation of the PCB computer, and the material utilization rate of the layout on the standard size copper clad laminate is determined. Comprehensive quotation.
The cost calculation of the PCB industry is the most special and complex of all industries. From cutting, pressing, forming, to FQC, packaging, and finished storage, it needs to be based on the material costs, labor costs, and manufacturing costs invested in each process. Perform step-by-step accounting, and then accumulate costs in batches based on the order product number. And for different types of products, the standard rate of the process will be different. For some products such as blind and buried vias, immersion gold boards, and pressed copper seat boards, some special calculation methods must be adopted due to the particularity of the process or all materials. In the same way, the size of the drill nozzle used in the drilling process will also affect the cost of the product, which directly affects the calculation and evaluation of WIP costs and scrap costs.
In addition, PCB factories are all products manufactured by OEM customers, and the products customized by different customers are not the same, and there are few shared products. On the other hand, out of quality considerations, some customers may also specify the use of substrates or inks from a certain manufacturer to meet their quality and cost control requirements.
Fast fish eat slow fish, only to respond quickly to changes in order to survive
ECN (Engineering Change Notification) changes.
ECN engineering changes often occur in the production process of PCB industry products, and there are often both internal ECN and external ECN changes (customer engineering file changes). Frequent ECN changes in product design, if improperly managed, the resulting scrap inventory will be very alarming. Therefore, how to plan the application of ECN product design changes in the ERP system is a very critical and important matter.
