PCB Technical - Synchronization of copper clad laminate and PCB

Copper Clad Laminate (CCL), as the substrate material in PCB manufacturing, mainly plays the role of interconnection, insulation and support to the PCB, and has a great impact on the transmission speed, energy loss, and characteristic impedance of the signal in the circuit. Therefore, the PCB The performance, quality, processability in manufacturing, manufacturing level, manufacturing cost, and long-term reliability and stability of CCL depend to a large extent on the material of the copper clad laminate.

CCL technology and production have gone through more than half a century of development. Now the world's annual output of CCL has exceeded 300 million square meters,

and CCL has become an important part of basic materials in electronic information products. The copper clad laminate manufacturing industry is a sunrise industry. It has broad prospects along with the development of electronic information and communication industries. Its manufacturing technology is a high-tech that intersects, penetrates, and promotes multiple disciplines. The development history of electronic information technology shows that copper clad laminate technology is one of the key technologies that promote the rapid development of the electronics industry.

The development of copper clad laminate technology and production and the electronic information industry, especially the development of the PCB industry are synchronized and inseparable. This is a process of continuous innovation and continuous pursuit. The progress and development of copper clad laminates are constantly driven by the innovation and development of electronic products, semiconductor manufacturing technology, electronic mounting technology, and PCB manufacturing technology.

The rapid development of the electronic information industry has enabled electronic products to develop in the direction of miniaturization, functionalization, high performance, and high reliability. From the general surface mount technology (SMT) in the mid-1970s to the high-density interconnect surface mount technology (HDI) in the 1990s, as well as the application of various new packaging technologies such as semiconductor packaging and IC packaging technology that have emerged in recent years, Electronic installation technology continues to develop in the direction of high density. At the same time, the development of high-density interconnect technology promotes the development of PCBs in the direction of high density. With the development of mounting technology and PCB technology, the technology of copper clad laminate as a PCB substrate material is also constantly improving.

Experts predict that the world's electronic information industry will grow at an average annual growth rate of 7.4% in the next 10 years. By 2010, the world's electronic information industry market will reach 3.4 trillion US dollars, of which electronic complete machines will account for 1.2 trillion US dollars, while communication equipment and computers will account for More than 70% of them amounted to 0.86 trillion U.S. dollars. It can be seen that the huge market for copper clad laminates as electronic basic materials will not only continue to exist, but also continue to develop at a growth rate of 15%. The relevant information released by the Copper Clad Laminate Industry Association shows that in the next five years, in order to adapt to the development trends of high-density BGA technology and semiconductor packaging technology, the proportion of high-performance thin FR-4 and high-performance resin substrates will increase.