PCB is one of the indispensable parts of electronic equipment, it appears in almost every kind of electronic equipment, in addition to fixing various large and small parts, the main function of PCB is to make the electrical connection of various parts. Because the raw material of PCB board is copper-clad board, there will be copper dumping in the process of PCB production, so what are the reasons for copper dumping of PCB board? Here is a brief introduction for you.
1. PCB circuit design is not reasonable, with thick copper foil design too thin circuit, will also cause excessive circuit etching and copper dumping.
2. copper foil etching is excessive, the electrolytic copper foil used in the market is generally single-sided galvanized (commonly known as ashing foil) and single-sided copper plating (commonly known as red foil), common copper dumping is generally more than 70um galvanized copper foil, red foil and 18um below ashing foil basically have no batch copper dumping.
iPCB manufacturing factory is committed to providing customers with one-stop electronic components online procurement services, providing thousands of electronic components procurement, price inquiry and trading, to ensure that all components are from the original factory or agents regular channels to purchase, to ensure that the original authentic, is the domestic professional electronic components procurement website.
3. In the process of PCB, local collision occurs, and the copper wire is separated from the base material by external mechanical force. This undesirable performance is poorly positioned or directional, the loose copper wire will have obvious distortion, or in the same direction of the scratch/impact mark. Peeling the copper wire at the bad place to see the copper foil hair surface, you can see that the color of the copper foil hair surface is normal, there will be no bad side erosion, and the copper foil peel strength is normal.
4. Under normal circumstances, as long as the laminate is pressed at a high temperature for more than 30min, the copper foil and the semi-cured sheet are basically combined completely, so the pressing generally does not affect the binding force of the copper foil and the base material in the laminate. However, in the process of laminate stacking and stacking, if PP pollution or damage of copper foil hair surface will also lead to insufficient binding force between copper foil and base material after lamination, resulting in positioning (only for large plates) or sporadic copper wire falling off, but there will be no abnormal copper foil peeling strength near the measured off line.
These are the reasons for PCB board to throw copper, want to know more, please continue to follow iPCB, we will continue to update more knowledge to share with you.