PCB Technical - Electronic accessories needed for PCBA circuit boards

In the process of PCBA circuit board production, it is necessary to rely on a lot of machinery and equipment to assemble a board. Often the quality level of a factory's machinery and equipment directly determines the manufacturing capacity.

The basic equipment required for PCBA production includes solder paste printer, placement machine, reflow soldering, AOI detector, component angle cutter, wave soldering, tin furnace, washing machine, ICT test fixture, FCT test fixture, Aging test racks, etc., PCBA circuit board processing plants of different sizes, the equipment equipped will have all the differences.

PCBA production equipment for electronics factory

1. Solder Paste Printer

Modern solder paste printers generally consist of plate loading, solder paste addition, imprinting, and circuit board transfer. Its working principle is: first fix the circuit board to be printed on the printing positioning table, and then the solder paste or red glue is printed on the corresponding pad through the stencil by the left and right scrapers of the printer. The transfer station is input to the placement machine for automatic placement.

The cleaning processes included in the solder paste printer include: wiping the bottom of the solder paste printer (water-based cleaning agent W2000), and off-line cleaning of the solder paste stencil (W1000/EC-200).

2. Mounter

Mounting machine: also known as "mounting machine", "Surface Mount System" (Surface Mount System), in the production line, it is configured after the solder paste printer, by moving the placement head to accurately mount the surface components A device placed on the PCB pad. Divided into two kinds of manual and automatic.

3. Reflow soldering

There is a heating circuit inside the reflow soldering, which heats air or nitrogen to a high enough temperature and blows it to the circuit board where the component has been attached, so that the solder on both sides of the component is melted and bonded to the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is easier to control.

4. AOI automatic optical detector

The full name of AOI (Automatic Optic Inspection) is automatic optical inspection, which is based on optical principles to detect common defects encountered in welding production. AOI is a new type of testing technology that is emerging, but it is developing rapidly, and many manufacturers have launched AOI automatic optical inspection equipment.

During automatic inspection, the machine automatically scans the PCB through the camera, collects images, compares the tested solder joints with the qualified parameters in the database, after image processing, checks out the defects on the PCB, and displays/marks the defects through the display or automatic signs Come out and be repaired by maintenance personnel.

5. Component trimming machine

6. Wave soldering

7. Tin furnace

In general, the tin furnace refers to a welding tool used in electronic welding. For discrete component circuit boards, the welding consistency is good, the operation is convenient, fast, and the work efficiency is high. It is a good helper for your production and processing.

8. Washing machine (ultrasonic or through spray cleaning machine)

It is used to clean PCBA circuit boards, and can remove contaminants and residues on the board after soldering. Improve and guarantee the reliability of PCBA circuit boards.

It has a very good removal ability for various types of no-clean solder paste residues, flux residues, oil stains, fingerprints, metal oxide layers, and electrostatic particles and dust. With the ultrasonic cleaning process, it can be used for high-cleaning cleaning of high-precision, high-density, high-tech components such as microBGAs, Flip-Chips, and other high-tech components such as camera modules.

9. ICT test fixture

ICT Test is mainly to test the PCBA circuit open circuit, short circuit and welding condition of all parts by contacting the test point of the PCB layout with the test probe.