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The application of inkjet printing technology of all-printed electronics in PCB is mainly manifested in three aspects: application in graphics transfer; application in embedded passive components; Including packaging aspects) in the application. These applications have brought changes and progress to the PCB industry.
From the perspective of current and future application and development prospects, the application of inkjet printing technology of all-printed electronics in PCBs is mainly manifested in the following three aspects: application in graphics transfer; application in embedded passive components ; Application in all-printed electronics (including packaging) that directly form circuits and connections. These applications will bring revolutionary changes and progress to the PCB industry.
Application in PCB graphics transfer: mainly reflected in 4 aspects
The application of inkjet printing technology in PCB pattern transfer is mainly in four aspects: corrosion resistance, plating resistance, solder mask and characters. Since the process of inkjet printing to form a resist pattern and a resist pattern is basically the same, and the solder resist pattern formed by inkjet printing is very close to the character pattern, so it is divided into the formation of a resist (plating resist) pattern and the formation of a solder resist below. /Character graphics two parts are briefly reviewed.
1. Application in the formation of anti-corrosion/anti-plating patterns
Use a digital inkjet printer to directly print the resist (anti-etching ink) onto the inner layer (or outer layer) on the board to obtain acid or alkaline resist pattern, which is cured by UV (ultraviolet) light After that, etching and film removal can be performed to obtain the required circuit patterns such as the inner layer. In the same way, the process of resisting the plating pattern is basically the same.
The use of digital inkjet printing technology and technology to obtain the anti-corrosion/anti-plating pattern not only reduces the production process of photographic film, but also avoids the process of exposure and development. The advantage of this is that it saves space and space, and significantly reduces It reduces material consumption (especially film and equipment, etc.), shortens the product production cycle, reduces environmental pollution, and reduces costs. At the same time, it is more important to significantly improve the position of the graphics and the alignment between layers (especially to eliminate the size deviation caused by the size change of the negative film and the exposure alignment), and improve the quality and increase the quality of the multi-layer PCB board. The product qualification rate is extremely favorable. Like laser direct imaging (LDI), it can shorten the PCB production cycle and improve product quality. It is an important reform and advancement in PCB industrial technology.
The graphics transfer technology using digital inkjet printing has the fewest processing steps (less than 40% of the traditional technology), the least equipment and materials, and the shortest production cycle. Therefore, the energy saving and emission reduction effect is the most significant, and the environmental pollution and cost are also the lowest.
2. Application in the formation of solder mask/character graphics
In the same way, a digital inkjet printer is used to directly print the solder resist (solder resist ink) or character ink directly onto the PCB on the PCB. After being cured by UV light, the final solder resist graphics and character graphics are obtained.
The use of digital inkjet printing technology and technology to obtain solder mask and character graphics significantly improves the position accuracy of solder mask and character graphics of PCB products. It is also extremely beneficial for improving the quality of PCB boards and increasing the product qualification rate.
Application in embedded passive components: production of higher-end products
At present, the methods of embedding passive components are mostly realized by methods such as resistive/capacitive copper clad laminates (CCL) or screen printing-related inks, but these methods are not only complex and complicated, but also have long cycles., There are many equipments and occupy a lot of space, and the product performance deviation is large, it is difficult to produce high-grade products. More importantly, it consumes a lot of energy during processing and produces a lot of pollution, which is not conducive to environmental protection. The use of inkjet printing technology to realize the method of embedding passive components will greatly improve these conditions.
The application of inkjet printing in embedded passive components means that the inkjet printer directly prints the conductive ink and other related inks used as passive components on the set position inside the PCB, and then undergoes UV light treatment or drying/sintering. Processing to form a PCB product with embedded passive components.
The passive components mentioned here refer to resistors, capacitors and inductors (now developed to embed active components, such as system packaging). Due to the development of high density and high frequency of electronic products, in order to minimize the distortion and noise caused by crosstalk (inductive reactance, capacitive reactance), etc., more and more passive components are needed. At the same time, due to the increasing number of passive components, not only accounted for an increasing proportion of the area, but also more and more solder joints, which has become the biggest factor in the failure rate of industrial electronic products. In addition, the secondary interference caused by the loop formed by surface-mounted passive components, etc., these factors are increasingly threatening the reliability of electronic products. Therefore, embedding passive components in the PCB to improve the electrical performance of electronic products and reduce the failure rate has begun to become one of the mainstream products in PCB production.
On the principle and method of embedding passive components in PCB. Generally speaking, passive components with embedded resistors, capacitors and inductors are mostly placed on the second and penultimate layer of a multilayer PCB (n-1), except for common capacitors placed between the electrical/ground layers. superior.
The resistive conductive adhesive (ink) used as a resistor is sprayed onto the set position of the inner layer of the PCB (etched) by inkjet printing equipment, and the two ends of the bottom are connected by etched wires (open circuits). After baking, testing, and then pressing into the PCB board, it is ready.
In the same way, the capacitor conductive adhesive (ink) used as a capacitor is sprayed on the copper foil at a preset position by an inkjet printer, dried and/or sintered, and then sprayed with a layer of conductive ink containing silver, and then dried And/or sintering, then lamination (upside down), etching, not only to form a capacitor, but also to form an inner layer circuit.
