PCB Technical - Stacked design of balanced pcb circuit board

If PCB routing does not require additional layers, why use it? Wouldn't reducing the layers make the circuit board thinner? If there is one less circuit board, wouldn't the cost be lower? However, in some cases, adding a layer will reduce the cost.

The PCB board has two different structures: core structure and foil structure.

In the core structure, all the conductive layers in the PCB board are coated on the core material; in the foil-coated structure, only the internal conductive layer of the PCB board is coated on the core material, and the outer conductive layer is a foil-coated dielectric board. All conductive layers are bonded together through a dielectric using a multilayer lamination process.

The nuclear material is the double-sided foil-clad board in the factory. Because each core has two sides, when fully utilized, the number of conductive layers of the PCB board is an even number. Why not use foil on one side and core structure for the rest? The main reason is: the cost of the PCB board and the bending degree of the PCB board.

The cost advantage of even-numbered PCB

Because of the lack of a layer of dielectric and foil, the cost of raw materials for odd-numbered PCBs is slightly lower than that of even-numbered PCBs. However, the processing cost of odd-numbered PCB boards is significantly higher than that of even-numbered PCB boards. The processing cost of the inner layer is the same; but the foil/core structure obviously increases the processing cost of the outer layer.

Odd-numbered PCB boards need to add a non-standard laminated core layer bonding process on the basis of the core structure process. Compared with the nuclear structure, the production efficiency of factories that add foil to the nuclear structure will decrease. Before lamination and bonding, the outer core requires additional processing, which increases the risk of scratches and etch errors on the outer layer.

Balance structure to avoid bending

The best reason not to design PCB boards with odd-numbered layers is that the odd-numbered layers PCB boards are easy to bend. When the PCB board is cooled after the multilayer circuit bonding process, the different lamination tension of the core structure and the foil-clad structure will cause the PCB board to bend. As the thickness of the circuit board increases, the risk of bending of the composite PCB board with two different structures becomes greater. The key to eliminating PCB board bending is to adopt a balanced stack. Although the PCB board with a certain degree of bending meets the specification requirements, the subsequent processing efficiency will be reduced, resulting in an increase in cost. Because special equipment and craftsmanship are required during assembly, the accuracy of component placement is reduced, which will damage the quality.

Using even-numbered PCB boards When an odd-numbered PCB board appears in the design, the following methods can be used to achieve balanced stacking, reduce PCB board production costs, and avoid PCB board bending. The following methods are arranged in order of preference.

1. A signal layer and use it. This method can be used if the power layer of the design PCB is even and the signal layer is odd. The added layer does not increase the cost, but it can shorten the delivery time and improve the quality of the PCB board.

2. Add an additional power layer. This method can be used if the power layer of the design PCB is odd and the signal layer is even. A simple method is to add a layer in the middle of the stack without changing other settings. First, follow the odd-numbered PCB board wiring, then copy the ground layer in the middle, and mark the remaining layers. This is the same as the electrical characteristics of a thickened layer of foil.

3. Add a blank signal layer near the center of the PCB stack. This method minimizes the stacking imbalance and improves the quality of the PCB board. First, follow the odd-numbered layers to route, then add a blank signal layer, and mark the remaining layers. Used in microwave circuits and mixed media (different dielectric constants) circuits.