At present, in the field of electronic product processing, PCB board is indispensable as one of the important electronic components. At present, there are many types of PCB board, such as high-frequency PCB boards, microwave PCB board and other types of printed circuit boards that have gained a certain reputation in the market.
1. Consider the choice of substrate
PCB substrates can be divided into two categories: organic materials and inorganic materials. Each material has its own unique advantages. Therefore, the determination of the type of substrate considers various properties such as dielectric properties, copper foil type, base groove thickness, and processability characteristics. Among them, the thickness of the surface copper foil is a key factor affecting the performance of this printed circuit board. Generally speaking, the thinner the thickness, the more convenient the etching and the improvement of the precision of the graphics.
Pay attention to the following three aspects when PCB board processing
2. Consider the setting of the production environment
The environment of the PCB board processing and production workshop is also a very important aspect. The regulation of ambient temperature and ambient humidity are both crucial factors. If the ambient temperature changes too significantly, it may cause the holes on the base plate to break. If the environmental humidity is too high, nuclear energy will have an adverse effect on the performance of the substrate with strong water absorption, specifically in terms of dielectric properties. Therefore, it is necessary to maintain proper environmental conditions during PCB processing and production.
3. Consider the choice of process flow
The production of PCB is easily affected by many factors. The number of layers, punching process, surface coating treatment and other processes will all affect the quality of the finished PCB board. Therefore, for these process environments, PCB board processing and production are fully considered in combination with the characteristics of the production equipment, and can be flexibly adjusted according to the types of PCB boards and processing requirements.
In summary from the above description, the choice of substrate, the setting of the production environment, and the choice of process flow need to be considered when PCB processing is made. At the same time, the processing and blanking methods of PCB engineering materials are also an aspect that needs to be carefully selected, which is closely related to the smoothness of the printed circuit board.
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