PCB Technical - Several common surface treatments for pcb board proofing

Several common surface treatments for PCB board proofing

The surface treatment methods used in PCB proofing are different. Each surface treatment method has its own unique characteristics. Taking chemical silver as an example, its manufacturing process is extremely simple. It is recommended for lead-free soldering and smt use, especially for fine The circuit effect is better, and the most important thing is to use chemical silver for surface treatment, which will greatly reduce the overall cost and lower the cost. The editor of Zhongke Circuit will introduce you several common surface treatment methods for PCB proofing.

1. HASL hot air leveling (that is, spray tin)

Tin spraying is a common processing method in the early stage of PCB proofing. Now it is divided into lead spray tin and lead-free spray tin. The advantages of tin spraying: After the PCB is completed, the copper surface is completely wetted (the tin is completely covered before soldering), suitable for lead-free soldering, the process is mature and the cost is low, suitable for visual inspection and electrical testing, and it is also a high-quality and reliable PCB board One of the proofing processing methods.

2. Chemical nickel gold (ENIG)

Nickel gold is a kind of surface treatment process for PCB board sampling. Remember: the nickel layer is a nickel-phosphorus alloy layer. According to the phosphorus content, it is divided into high-phosphorus nickel and medium-phosphorus nickel. The application is different, so we will not introduce it here. the difference. The advantages of nickel gold: suitable for lead-free soldering; very flat surface, suitable for SMT, suitable for electrical testing, suitable for switch contact design, suitable for aluminum wire binding, suitable for thick plates, and strong resistance to environmental attacks.

3. Electroplating nickel gold

Electroplated nickel gold is divided into "hard gold" and "soft gold". Hard gold (such as gold-cobalt alloy) is commonly used on gold fingers (contact connection design), and soft gold is pure gold. Electroplating of nickel and gold is widely used on IC substrates (such as PBGA). It is mainly used for bonding gold and copper wires, but the IC substrate is suitable for electroplating. The bonding gold finger area requires additional conductive wires to be electroplated. The advantages of electroplated nickel-gold PCB board proofing: suitable for contact switch design and gold wire binding; suitable for electrical testing

4. Nickel Palladium (ENEPIG)

Nickel, palladium, gold is now gradually beginning to be used in the field of PCB proofing, and it has been used more in semiconductors before. Suitable for bonding of gold and aluminum wires. Advantages of proofing with nickel-palladium-gold PCB board: application on IC carrier board, suitable for gold wire bonding and aluminum wire bonding. Suitable for lead-free soldering; compared with ENIG, there is no nickel corrosion (black plate) problem; the cost is cheaper than ENIG and electric nickel gold, suitable for a variety of surface treatment processes and on-board.