With the high-density interconnection design of PCB circuit boards and the improvement of electronic technology, carbon dioxide (CO2) laser processing equipment has become an important tool for circuit board manufacturers to process PCB circuit board micro-holes, and the development of laser processing PCB micro-hole technology has also improved rapidly. . Let's take a closer look with the editor~
At present, some large-scale printed circuit board manufacturers in the world are gradually adopting carbon dioxide (CO2) laser and UV laser hole forming technology for processing multi-layer PCB multi-layer boards with higher density interconnections, following the continuous development of copper carving crafts technology Improved, carbon dioxide (CO2) laser processing to form holes has been rapidly popularized and widely used in PCB multilayer circuit boards. And further promote the multilayer multilayer board to the field of flip chip packaging,
thereby promoting the development of the multilayer multilayer board to a higher density. As a result, the number of blind hole processing holes in multi-layer PCB multi-layer boards is increasing, and its single side is generally about 20,000 to 70,000 holes, and even as high as 100,000 holes or more. : For such a large number of blind holes, in addition to using the photo-induced method and plasma method to make the blind holes, especially as the blind via hole diameter becomes smaller and smaller, the use of carbon dioxide (CO2) laser and UV Laser processing to manufacture blind vias is one of the low-cost, high-speed processing methods that circuit board manufacturers can achieve.
PCB circuit board
The method of laser processing PCB circuit boards has been applied to circuit board manufacturers so far. Because the micro-hole requirements of multilayer PCB multilayer boards have increased sharply, coupled with the excellence and perfection of CO2 laser equipment and processing technology, CO2 lasers have been rapidly promoted and applied. . At the same time, it has also developed a less chaotic solid-state (bulk) laser device. After multiple harmonics, it can reach the ultraviolet light level laser, because the peak value can reach 12kw, the repetitive power can be at 50, and it is suitable for various kinds of lasers. PCB circuit board materials (including copper foil and glass fiber cloth, etc.), so for the processing of micro-holes less than 0.1 microns, it is undoubtedly one of the most high-density interconnect multi-layer PCB multi-layer boards produced by circuit board manufacturers. Promising processing method.
High-precision PCB is actually applied to the laser processing equipment for PCB circuit boards produced by circuit board manufacturers. The main laser processing equipment for PCB circuit boards are carbon dioxide lasers and UV lasers. The functions of the laser sources of these two lasers are different. One is for burning copper. One is for burning the substrate, so the CO2 laser and UV laser are used in the laser processing of PCB circuit boards.