PCB Technical - PCB market development trend

From the perspective of the number of layers and development direction of PCB, the PCB industry is divided into six main product segments: single panel, double panel, conventional multilayer board, flexible board, HDI (High Density Interconnect) board, and package substrate. From the perspective of the four cyclical dimensions of the product life cycle, such as "introduction period-growth period-maturity period-decline period", the single-panel and double-panel are in a recession period because they are not suitable for the current application trend of short, light and thin electronic products. The proportion is gradually decreasing. Developed countries and regions such as Japan, South Korea and Taiwan of China have rarely produced such products in their homeland, and many large manufacturers have made it clear that they will no longer accept single and double panels. Conventional multilayer boards and HDI are mature products, with increasingly mature process capabilities and high added value of products. They are currently the main supply direction of most major PCB manufacturers. Only a few Chinese manufacturers such as Ultrasonic Electronics have the production technology; High-density flexible boards and rigid-rigid boards are not mature enough to achieve mass production by a large number of manufacturers. They are products in the growth stage, but they are more suitable for digital products than rigid boards. Characteristics, the growth of flexible boards is very high, which is the future development direction of major manufacturers.

The packaging substrates used in IC are relatively mature in developed electronics industries such as Japan and South Korea, both in R&D and manufacturing, but they are still in the technological exploration stage in China. Only Ibiden (Beijing) Co., Ltd., ASE Semiconductor (Shanghai) Co., Ltd., and Zhuhai A few manufacturers such as Doumen Chaoyi Electronics Co., Ltd. produce in small batches. This is because China’s IC industry is still very underdeveloped. However, as multinational electronics giants continue to move IC R&D institutions to China, and China’s own IC R&D and production levels improve, packaging substrates will have a huge market, which is a visionary. The development direction of the factory. China's rigid boards (single-sided, double-sided, multilayer, and HDI boards) account for 70% of the total, of which 50% multilayer boards account for the largest proportion, followed by soft boards with 15.6%. Due to the pressure of oversupply, most manufacturers entered a price war, and the growth of output value was lower than expected.

From the perspective of the future development trend of domestic PCB products, the increase in output is slightly lower than the increase in sales, mainly due to the gradual development of the product structure to multi-layer and high-precision. China's multi-layer boards and HDI boards are in the growth stage of the industry, the scale is constantly expanding, and the technology is becoming more and more mature. Multilayer boards are still the mainstream of market development; while HDI boards are in a period of rapid development driven by the demand for upgrading of downstream electronic information products.