PCB Technical - PCB prototype manufacturing process

PCB prototype manufacturing process is the production process of printed circuit board. Almost every kind of electronic equipment, from electronic watches and calculators to computers, communication electronic equipment and military weapon systems, as long as there are electronic components such as integrated circuits, PCB should be used for the electrical interconnection between them.

First, let's understand some concepts about PCB:

(1) Unit: unit refers to the unit graphics designed by the PCB design engineer.

(2) Set: set refers to a graph in which engineers put multiple units together to form a whole in order to improve production efficiency and facilitate production. That is what we often call panel, which includes unit graphics, process edges and so on.

(3) Panel: panel refers to a working board produced by a PCB manufacturer by splicing multiple sets together and adding tool board edges in order to improve efficiency and facilitate PCB production.

PCB prototype manufacturing process

1. PCB CAM Engineering Production

In PCB prototype manufacturing system, CA M production is the process of converting CAD data to conform to PCB process production standards.

2. PCB prototype material

Objective: To cut large PCB sheets into small pieces to produce them according to MI requirements of Engineering data. Small pieces to meet customer requirements.

Process: Sheet Material_Cutting Board_Ramp Board_Beer Round Corner_Grinding Edge_Out Board as MI Requirements

3. PCB prototype drilling

Purpose: According to the engineering data, drill the required hole in the corresponding position on the sheet which meets the required dimensions.

Process: Stacked pins Upper plate Bore holes Lower plate Inspection Repair

4. Copper Deposition of PCB Prototype

Objective: Copper deposit is a thin layer of copper deposited on the wall of insulated holes by chemical method.

Process: Coarse grinding Hanging plate Copper sinking automatic line Lower plate Dipping%dilute H2SO4 Thickening copper

5. PCB Prototype Graphics Transfer

Purpose: Graphic transfer is the transfer of images on a production film to a board

Process: (Blue oil process): grinding plate printing first side drying printing second side drying explosion shading inspection; (dry film process): linen sheet pressure film static alignment exposure static imaging inspection

6. PCB prototype graphics electroplating

Objective: Graphic electroplating is to electroplate a required thickness of copper layer and a required thickness of gold, nickel or tin layer on the bare copper skin or on the hole wall of the line graphic.

Process: Upper plate Degreasing Washing twice Microetching Washing pickling Copper plating Washing Soaking Tin plating Washing Lower plate

7. PCB prototype decidua

Objective: To remove the anti-plating coating with NaOH solution so as to expose the non-wired copper layer.

Process: Water Membrane: Jack Alkaline Rinsing Scrubbing Over-machine; Dry Membrane: Placement Over-machine

8. PCB prototype etching

Objective: Etching is to remove the copper layer from the off-line area by chemical reaction.

9. Solderproof green oil from PCB

OBJECTIVE: Green oil is the transfer of the green film graphic onto the board to protect the circuit and prevent tin from being soldered on the circuit.

Process: grinding plate printing light-sensitive green oil baking plate exposure shading; grinding plate printing first side baking board printing second side baking board

10. print PCB characters

Purpose: Characters provide a recognizable marker

Process: Green Oil End Batch Cooling Static Adjusting Screen Printing Character Back Batch

11. Gold finger plated with PCB

Objective: To coat the plug finger with a required thickness of nickel\gold layer to make it harder and more resistant to wear.

Process: Upper plate Degreasing Washing in water twice Microetching Washing in water twice pickling Copper plating Washing in water Nickel plating Washing in water Gold plating

Tin-plated HASL process for PCB boards (a side-by-side process)

AIM: Tin spraying HASL sprays a layer of lead and tin on bare copper surface without covering the solder resistance oil to protect the copper surface from corrosion and oxidation so as to ensure good solderability.

Process: Micro-etching air drying preheating rosin coating solder coating hot air leveling air cooling washing air drying

12. PCB Forming

OBJECTIVE: Organic gong, beer board, Gong and hand-cut are formed by stamping moulds or numerical control gong machine to take out the shape needed by customers.

Description: Data Gong board and beer board have high accuracy, followed by gong, and the lowest hand cutting board can only do some simple shapes.

13. PCB Testing

Objective: To detect the defects that affect the function such as open circuit and short circuit which are not easy to see through the electronic 00% test.

Process: Upper Mould Placement Test Qualified FQC Visual Inspection Unqualified Repair Re-test OK REJ Scrap

14. PCB Prototype Final Inspection

Objective: To avoid problems and defective plate outflow by inspecting the appearance defect of the board with 00% visual inspection and repairing the slight defect.

Specific workflow: incoming materials viewing data visual inspection qualified FQA random inspection qualified packaging unqualified handling checking OK.

Today, iPCB briefly introduced the manufacturing process of the PCB prototype. iPCB is a professional PCB manufacturer. If you want to know more about PCB, we welcome you to visit the smart PCB factory of iPCB.