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Whether it is military aerospace communications or civilian consumer electronics, the increasingly diversified functions and high reliability requirements, the increasing demand for high-performance PCB circuit boards; therefore, high-density and fine circuit design and the application of new materials make the PCB manufacturing process more Complex and challenging, plasma processing technology has gradually been recognized by PCB manufacturers and replaced chemical or mechanical processing methods with its obvious advantages to meet today's increasingly stringent PCB manufacturing process requirements.
Compared with the traditional wet chemical treatment method, plasma treatment has the following advantages:
1. Controllable process; good consistency and repeatability
2. Strong permeability to fine lines, micropores, and high-thickness-to-diameter ratio products
3. It has a wide range of applications and can handle various materials including PTFE, LCP and other chemical-resistant special materials
4. Economical and environmentally friendly, no chemical solvents, no waste disposal requirements
Plasma is a partially ionized gas composed of a large number of active groups, including electrons, ions, free radicals and photons (UV and visible light). It is often regarded as the fourth state in which matter exists in addition to solid, liquid, and gaseous states. Because the number of positive and negative particles are equal and electrically neutral, it is called "plasma". Plasma treatment mainly has two reaction mechanisms: chemical reaction formed by free radicals and by-products and physical bombardment by ions. The two reaction mechanisms depend on the gas type and plasma mode, which can be applied to different PCB manufacturing process applications:
1. Desmear removes glue residue
2. Etch Back (Etch Etch)
3. Carbon removal (laser blind hole bottom cleaning)
4. PTFE Activation Teflon board activation
5. Remove dry film/green oil residue between Descum fine lines
6. Surface oxidation removal and activation, improving metal sputtering/weldability
7. Surface modification (roughening and activation):
a) Pre-treatment of reinforcement
b) Pre-laminating treatment
c) Pre-treatment of solder mask
d) Pre-processing of silk screen characters
e) Improve surface wettability and improve material coatability
The main indicators of the plasma treatment process in PCB manufacturing are the etching rate (gluing removal rate) and uniformity (uniformity). The uniformity is evaluated by weighing or slicing, including between the board and the board (in the cavity), in the board, and in the hole (hole Between the mouth and the hole) and so on. It depends on the overall design of the equipment, and is also closely related to the plasma process parameters including power, gas selection and flow, vacuum, and temperature control. The V30 series plasma machine developed by Apt Technology (Zhuhai) for PCB manufacturing applications is based on its reliable quality and Fast glue rate and industry-leading processing uniformity (uniformity) for HDI, high aspect ratio (>20:1), PTFE high frequency communication, backplane, server board and other high process requirements PCB production and are well received .
Features and advantages:
§ Industry-leading process performance, with high etching rate and uniformity of glue removal
§ Vertical-bipolar feeding electrode and cooling system to ensure synchronous and uniform processing of products
§ Unique gas distribution and diversion design to ensure uniform and efficient processing of large sizes and large batches,
§ Support 52’ large size product processing
§ Flexible configurable electrode/gas distribution scheme to adapt to the production environment and process requirements of changeable products and vehicles
§ The touch-sensitive graphical interface can monitor the production process and process variables in real time
§ Integrated design, compact and small footprint
§ Suitable for Rigid, Rigid-Flex, FPC, HDI, MSAP and other application requirements, especially high-end, high-aspect-ratio products and demanding process applications.
