PCB Technical - Characteristics of LED aluminum substrate

1, Characteristics of aluminum substrate
(1). Surface mount technology (SMT) is adopted;
(2). It is very effective to deal with the thermal diffusion in the circuit design scheme;
(3). Reduce the operating temperature of the product, improve the power density and reliability of the product, and extend the service life of the product;
(4). Reduce product volume, hardware and assembly costs;
(5). Replace fragile ceramic substrate to obtain better mechanical durability.
2, Structure of aluminum substrate
Aluminum based copper clad laminate is a kind of metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate
Circuit layer: equivalent to common PCB copper clad laminate, circuit copper foil thickness LOZ to 10oz.
Dielctriclayer layer: insulation layer is a layer of low thermal resistance thermal insulation material.
Baselayer: it is a metal substrate, usually aluminum or optional copper. Aluminum based copper clad laminates and traditional epoxy glass cloth laminates.
Circuit layer (i.e. copper foil) is usually etched to form printed circuit, so that the components of components are connected with each other. In general, the circuit layer requires a large current carrying capacity, so thick copper foil should be used The thermal insulation layer is the core technology of aluminum substrate. It is generally composed of special polymer filled with special ceramics, with small thermal resistance, excellent viscoelastic properties, thermal aging resistance and mechanical and thermal stress.
This technology is used in the thermal insulation layer of high-performance aluminum substrate, which makes it have excellent thermal conductivity and high-strength electrical insulation performance; metal base is the support component of aluminum substrate, which requires high thermal conductivity It is aluminum plate or copper plate (copper plate can provide better thermal conductivity), which is suitable for drilling, punching, cutting and other conventional machining. Compared with other materials, PCB material has incomparable advantages. It is suitable for SMT on the surface of power components. Without radiator, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good.
3, Application of aluminum substrate:
Purpose: Power Hybrid IC (HIC).
1. Audio equipment: input and output amplifier, balanced amplifier, audio amplifier, preamplifier, power amplifier, etc.
2. Power supply equipment: switch regulator, DC / AC converter, SW regulator, etc.
3. Communication electronic equipment: high frequency amplifier, filter and transmission circuit.
4. Office automation equipment: motor driver, etc.
5. Automobile: electronic regulator, igniter, power controller, etc.
6. Computer: CPU board, floppy disk drive, power supply device, etc.
7. Power module: converter, solid state relay, rectifier bridge, etc.