PCB Technical - What is the main reason for poor wetting caused by SMT processing

What is the main reason for poor wetting caused by SMT processing
In PCBA processing, when the surface tension of the solder is destroyed, it will cause poor soldering of surface mount components. The main manifestation of poor wetting is that during the soldering process, there is no reaction between the substrate solder area and the metal after the solder is infiltrated, resulting in less soldering or missing soldering.

Next, the editor will explain to you what is the main reason for poor wetting in the SMT processing of the smt factory?

1. The surface of the welding area is contaminated, the surface of the welding area is stained with flux, or metal compounds are generated on the surface of the SMD component. Will cause poor wetting. Such as sulfide on the surface of silver and oxide on the surface of tin will cause poor wetting.

2. When the residual metal in the solder exceeds 0.005%, the flux activity will decrease and poor wetting will also occur.

3. During wave soldering, there is gas on the surface of the substrate, which is also prone to poor wetting.

The methods to solve poor wetting are:

1. Strictly implement the corresponding welding process.

2. The surface of the PCB board and components should be cleaned.

3. Choose suitable solder, and set reasonable soldering temperature and time.
The above is the relevant content of the main reason for poor wetting caused by the smt factory in SMT processing, I hope it will be helpful to everyone!
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