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Circuit board hdi introduction:
HDI is the English abbreviation of High Density Interconnector, a high-density interconnect(HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating materials and conductor wiring. When printed circuit boards are made into final products, integrated circuits, transistors (transistors, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts are mounted on them.
With the help of wire connection, it can form electronic signal connection and function. Therefore, the printed circuit board is a platform that provides component connection and is used to accept the substrate of the connected parts.
HDI boards are generally manufactured by layer-by-layer method, the more the number of layers, the higher the technical grade of the plate. Ordinary HDI boards are basically layered once, and high-end HDI uses layered technology of 2 or more times. At the same time, advanced PCB technologies such as stacking holes, electroplating and filling holes, and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.
What is a first-order second-order circuit board:
1. Drill holes after pressing once == "Press the copper foil again outside == "Laser again -------- "First order
2. Drill holes after pressing once ==》Press the copper foil again on the outside ==》Laser again, and drill holes==》Press the copper foil again on the outer layer==》Laser again-------》Second order . It mainly depends on how many times your laser has been shot, that is, how many orders.
The second order has two types: stacked holes and bifurcated holes.
The picture below shows an eight-layer two-stage stacking hole. The 3-6 layers are laminated first, and the outer layer 2, 7 is laminated, and the laser hole is punched once. Then layer 1, 8 on it and make a laser hole again. It is to make two laser holes. Because such holes are superimposed, the process difficulty will be higher and the cost will be higher.
The picture below shows an eight-layer second-order cross blind hole. This processing method is the same as the eight-layer second-order stacked hole above. It also requires two laser holes. But the laser holes are not stacked together, so the processing difficulty is much less.
The third order, the fourth order and so on.
