PCB Technical - How efficient is the electronic assembly of ipcb?

In the process of SMT patch processing, IPCB needs to fully assemble PCB circuit board with some production equipment. Testing the processing capacity of SMT patch processing plant also depends on whether the performance of SMT technology production equipment and production equipment meets the standards and has high efficiency and quality.

1, solder paste printer: Modern solder paste printers are generally composed of installing plates, adding solder paste, stamping, power transmission substrates, etc. It works by first fixing the printed PCB circuit board on the printing positioning table, then using the left and right scrapers of the printer to leak the solder paste and red glue through the steel mesh to the corresponding bonding pad, evenly spreading the leakage onto the PCB circuit board, and then the PCB board is automatically patched by the transmission table input patch machine.

2. Fully automatic patch machine: also known as patch machine, SurfaceMount System. After the printer is configured on the production line, the production equipment of the patch machine is correctly configured by moving the patch machine. According to the precision of installation and the speed of installation, the operation mode of SMT technology equipment is usually divided into high speed and normal speed.

3. Reflux welding: There is a circuit inside the reflux welding to heat the PCB circuit board. After heating up the air and nitrogen to a high enough temperature, the SMT patch machine has already attached the PCB board of the part, so that the solder on both sides of the part melts and is bonded to the PCB main board. The advantage of this process is that the temperature is easy to control and oxidation can be avoided in the welding. Production and processing costs are also more easily controlled.

In today's society, with the rapid development of electronic manufacturing industry, SMT patch technology also has a lot of success. In this case, why does patch operation become an inevitable link in the company's production plant manufacturing? How can SMT patch processing technology speed up the efficiency of electronic assembly?

Micro-nano patch processing and some precision processing techniques used in electronic manufacturing are collectively referred to as micro-patch processing. Micro-nano patch processing in micro-patch processing technology is basically a planar integration method. The basic idea of planar integration is to construct micro-nano structures on planar substrate materials by stacking them one by one, and to use photon beams. The processing methods of PCBA circuit board patches such as cutting, welding, 3D printing, etching and sputtering by electron and ion beams also belong to the SMT technology of micro-patch processing.

The interconnection between the chip and the lead-out circuit of the PCB board, such as inverted bonding, lead bonding, SMT technology such as silicon through hole (TSV), envelope technology after the chip and the board are interconnected, which is commonly referred to as chip packaging technology, passive component manufacturing technology, including capacitors, resistors, inductors, transformers, filters, A combination of manufacturing technologies for passive components such as antennas.

Photoelectronic packaging is the system integration of photoelectronic devices, electronic components and functional application materials. In the optical communication system, photoelectronic packaging can be divided into IC-level chip packaging, device packaging, micro-electromechanical system manufacturing technology, PCB circuit board micro-chip processing technology to integrate sensors, executors, and processing control circuit micro-systems on a single silicon chip.