PCB Technical - Introduction to FPC circuit board via plug hole

Introduction to FPC circuit board via plug hole
Vias play the role of interconnection and conduction of circuits. The development of the electronics industry also promotes the development of FPC circuit boards, and also puts forward higher requirements for printed board manufacturing processes and surface mount technology. FPC circuit board plugging technology came into being, and should meet the following requirements at the same time:
1. There is copper in the via hole, and the solder mask can be plugged or not plugged;
2. There must be tin and lead in the via hole, with a certain thickness requirement (4 microns), and no solder mask ink should enter the hole, causing tin beads to be hidden in the hole;
3. The through holes must have solder mask ink plug holes, opaque, and must not have tin rings, tin beads, and flatness requirements.
With the development of electronic products in the direction of "light, thin, short and small", FPC circuit boards have also developed to high density and high difficulty. Therefore, a large number of smt and BGA FPC circuit boards have appeared, and customers require plugging when mounting components. Hole has five main functions:
1. Prevent the FPC circuit board from being short-circuited by the tin through the through hole through the component surface when the FPC circuit board is wave soldered; especially when we put the via on the BGA pad, we must first make the plug hole, and then plate it with gold, which is convenient for the BGA soldering .
2. Avoid flux residue in the vias;

3. After the surface mounting of the electronics factory and the assembly of the components are completed, the PCB must be vacuumed to form a negative pressure on the testing machine to complete:
4. Prevent surface solder paste from flowing into the hole, causing false soldering and affecting placement
5. Prevent the tin balls from popping up during wave soldering, causing short circuits.
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