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Taking the PCB fabrication process of double sided PCB and 4layers PCB as an example, the PCB fabrication process of printed circuit board includes etching process and electroplating process, which is a combination of various processes.
According to the predetermined design to make printed circuit, printed components or a combination of the two conductive graphics known as printed circuit. The following describes the PCB fabrication process.
PCB fabrication process
Basic process PCB fabrication method of printed circuit board:
1. Cutting
Objective: according to the requirements of engineering data mi, cut into small pieces of fabrication plate on the large sheet material which meets the requirements of the customer
Process: large plate - cutting plate according to MI requirements - curizing plate - fillet / edge grinding - plate out
2. Drilling
Objective: according to the engineering data, drill the required hole diameter on the plate with required size
Process: fold plate pin - upper plate - drill hole - lower plate - check and repair
3. Copper deposition
Objective: copper deposition is to deposit a thin layer of copper on the wall of insulating hole by chemical method
Process: rough grinding - hanging board - semi-automatic copper sinking line - plate lowering - 100% dilute H2SO4 dipping - thickening copper
4. Graphic transfer
Objective: graphic transfer is to transfer the image from film to board
Process: (blue oil process): grinding plate - printing the first side - baking - printing the second side - baking - exposure - development - investigation; (dry film process): Hemp board - lamination - standing - alignment - exposure - standing - standing - development - arrest
5. Pattern plating
Objective: pattern electroplating is to electroplate a layer of copper layer with required thickness and gold nickel or tin layer on the exposed copper sheet or hole wall of circuit pattern
Process: upper plate - degreasing - secondary water washing - micro corrosion - water washing - pickling - copper plating - water washing - acid pickling - tin plating - water washing - lower plate
6. Depigmentation
Objective: to remove the anti - plating coating with NaOH solution to expose the non - line copper layer
Process flow: water film: inserting rack - soaking alkali - washing - washing - passing machine; dry film: placing plate - passing machine
PCB fabrication equipment
7. Rotten engraving
Objective: etching is to use the chemical reaction method to corrode the copper layer of non - line parts
8. Green oil
Objective: green oil is to transfer the figure of green film to the board to take care of the circuit and block the tin on the circuit when welding parts
Process: grinding plate - printing photosensitive green oil - curium plate - exposure - development; grinding plate - printing the first side - drying plate - printing the second side - drying plate
9. Character
Objective: character is an easy to identify mark provided
Process: green oil final curium - cooling and standing - screen adjustment - character printing - rear curium
10. Gold Plated finger
Objective: to coat the finger of plug with a layer of nickel / gold layer of required thickness to make it more wear-resistant
Process: plate loading - degreasing - twice water washing - micro etching - twice water washing - pickling - copper plating - water washing - nickel plating - water washing - gold plating tin plate (a kind of parallel process)
Objective: tin spraying is to spray a layer of lead and tin on the exposed copper surface which is not covered with solder blocking oil, so as to protect the copper surface from corrosion and oxygenation as much as possible, so as to ensure satisfactory welding performance. The process: Micro etching - air drying - preheating - rosin coating - solder coating - hot air leveling - air cooling - scrubbing and air drying
11. Molding
Objective: through the production model stamping or digital control gongs and gongs, we can produce the style and molding method required by customers. Organic gongs, beer boards, small gongs, and hand cutting explain clearly: the numerical gongs, machine boards and beer boards are very accurate, and the small gongs are second, the manual cutting boards can only make a simple shape
12. Testing
Objective: to test the open circuit, short circuit and other defects that affect the functionality of the device
Process: mold - plate placement - test - standard compliance - FQC visual inspection - unqualified standard - repair - retest - OK - rej - discard
13. Final inspection
Objective: through 100% visual inspection of the board appearance defects, and repair the small defects, to prevent the problems and the lack of plate outflow
Process: incoming materials - inspection data - visual inspection - compliance with standards - FQA sampling inspection - conforming to standards - packaging - substandard standards - disposal - checking and checking OK
