PCB Technical - High frequency microwave board: what should be paid attention to in the production of board

I. Introduction

With the continuous development of science and technology, especially information technology, the process technology of high-frequency circuit board production is correspondingly improved to meet the needs of different users. In recent years, the fields of communications, automobiles, etc. have developed very rapidly, and the demand for high-frequency circuit boards has undergone some changes, and the demand for high-power, high-frequency circuit boards and high-frequency microwave boards has increased. Many bosses of high-frequency circuit board manufacturers are optimistic about this growth point, but how to make high-frequency microwave boards well, companies must practice their internal skills. Next, the editor of Shenzhen ipcb will discuss with you the matters needing attention in the production process of high-frequency microwave boards.

2. the basic requirements of high-frequency microwave panels

1. When designing the substrate, the telecommunications engineer has selected the specified dielectric constant, dielectric thickness, and copper foil thickness according to the actual impedance requirements. Therefore, when accepting the order, it must be carefully checked and the design requirements must be met.

2. The production accuracy of transmission lines requires the transmission of high-frequency signals, and the characteristic impedance requirements of printed wires are very strict, that is, the production accuracy of transmission lines is generally ±0.02mm (the transmission line with ±0.01mm accuracy is also very common), transmission lines The edges should be very neat, and tiny burrs and gaps are not allowed.

3. The coating requires that the characteristic impedance of the high-frequency microwave board transmission line directly affects the transmission quality of the microwave signal. The characteristic impedance has a certain relationship with the thickness of the copper foil. Especially for the microwave board with hole metallization, the thickness of the coating not only affects the total thickness of the copper foil, but also affects the accuracy of the wire after the etching room. Therefore, the thickness of the coating And uniformity should be strictly controlled.

4. Requirements for mechanical processing: First, the material of the high-frequency microwave board is very different from the epoxy glass cloth material of the printed board in terms of machining; secondly, the processing accuracy of the high-frequency microwave board is much higher than that of the circuit board., The general shape tolerance is ±0.1mm (the high precision is generally ±0.05mm or 0~-0.1mm).

5. The requirement of characteristic impedance I have already talked about the content of characteristic impedance. It is the most basic requirement of high-frequency microwave board. It cannot meet the requirement of characteristic impedance. Everything is in vain

ipcb is a Printed Circuit Board(prototype & standard PCB) Fabrication and PCB Assembly(PCBA) manufacturer. Specialized in manufacturing Microwave PCB, HDI-Multilayer PCB, IC Substrate, IC Test board, and Rigid-Flex PCB