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PCB Technical

PCB Technical - Brief description of the reason and improvement of no copper in the CB board hole

PCB Technical

PCB Technical - Brief description of the reason and improvement of no copper in the CB board hole

Brief description of the reason and improvement of no copper in the CB board hole

2021-09-09
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Author:Frank

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PCB circuit board Double-sided circuit board and above will need to sink copper in the hole, so that the via hole has copper and becomes a via hole. However, after inspection during the production process, the manufacturer will occasionally find that there is no copper or copper unsaturated in the hole after the copper is deposited. Now our company briefly describes several reasons
PCB circuit boards above the double-sided circuit board will need to sink copper in the holes, so that the vias have copper and become vias.
However, after inspection during the production process, the manufacturer will occasionally find that there is no copper or copper unsaturated in the hole after the copper is deposited. Now our company briefly describes several reasons. The reason for the hole-free copper is nothing more than:
1. Drilling dust plug holes or thick holes.

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2. There are bubbles in the potion when the copper is sinking, and the copper is not sinking in the hole.
3. There is circuit ink in the hole, the protective layer is not electrically connected, and the hole is free of copper after etching.
4. The acid-base solution in the hole is not cleaned after copper sinking or after the board is powered on, and the parking time is too long, resulting in slow biting corrosion.
5. Improper operation, too long in the process of micro-etching.
6. The pressure of the punching plate is too high, (the design punching hole is too close to the conductive hole) and the middle is neatly disconnected.
7. Poor penetration of electroplating chemicals (tin, nickel).
Make improvements to these 7 reasons for the problem of no copper in holes.
1. Add high-pressure water washing and de-smearing processes to holes that are prone to dust (such as 0.3mm or less aperture containing 0.3mm).
2. Improve potion activity and shock effect.
3. Change the printing screen and counterpoint film.
4. Extend the washing time and specify how many hours to complete the graphics transfer.
5. Set the timer. 6. Increase explosion-proof holes. Reduce the force on the board.
7. Do penetration testing regularly. So knowing that there are so many reasons that can cause the hole to have no copper open circuit, do you need to analyze it every time? ? Should we go to prevent