PCB Technical - PCB design electrostatic analysis, the commonly used discharge methods are these!

PCB design electrostatic analysis, the commonly used discharge methods are these!

In the design of the PCB board, the anti-ESD design of the PCB can be realized through layering, appropriate layout and installation. By adjusting the PCB layout and wiring, it is possible to prevent ESD well. Use multi-layer PCBs as much as possible. Compared with double-sided PCBs, the ground plane and power plane, as well as the closely arranged signal line-ground line spacing can reduce the common mode impedance. And inductive coupling, making it reach 1/10 to 1/100 of the double-sided PCB. There are components on the top and bottom surfaces, and there are very short connecting lines.

Static electricity from the human body, the environment, and even electronic equipment can cause various damages to precision semiconductor chips, such as penetrating the thin insulating layer inside the components; destroying the gates of MOSFET and CMOS components; and the triggers in CMOS devices are locked. ; Short-circuit reverse-biased PN junction; short-circuit forward-biased PN junction; melt the soldering wire or aluminum wire inside the active device. In order to eliminate electrostatic discharge (ESD) interference and damage to electronic equipment, a variety of technical measures need to be taken to prevent it.

In the design of the PCB board, the anti-ESD design of the PCB can be realized through layering, appropriate layout and installation. In the design process, the vast majority of design modifications can be limited to the addition or reduction of components through prediction. By adjusting the PCB layout and routing, ESD can be well prevented. The following are some common precautions.

Use multi-layer PCBs as much as possible. Compared with double-sided PCBs, the ground plane and power plane, as well as the tightly arranged signal line-ground spacing can reduce the common mode impedance and inductive coupling, making it 1/of the double-sided PCB. 10 to 1/100. Try to put each signal layer close to a power layer or ground layer. For high-density PCBs with components on the top and bottom surfaces, short connection lines, and many fills, you can consider using inner layer lines.

For double-sided PCBs, tightly interwoven power and ground grids are used. The power line is close to the ground line, and as many connections as possible between the vertical and horizontal lines or the filled area. The grid size on one side is less than or equal to 60mm. If possible, the grid size should be less than 13mm. Make sure that each circuit is as compact as possible.