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The direct cause of the temperature rise of the PCB factory's circuit board is due to the existence of circuit power consumption devices. Electronic devices all have power consumption to varying degrees, and the heating intensity varies with the size of the power consumption.
1. Two phenomena of temperature rise in PCB:
(1) Local temperature rise or large area temperature rise;
(2) For short-term temperature rise or long-term temperature rise, when analyzing PCB thermal power consumption, it is generally analyzed from the following aspects.
2. Electrical power consumption
(1) Analyze the power consumption per unit area;
(2) Analyze the distribution of power consumption on the PCB.
3. PCB structure
(1) PCB size;
(2) PCB material.
4. How to install PCB
(1) Installation method (such as vertical installation, horizontal installation);
(2) The sealing condition and the distance from the casing.
5. Thermal radiation
(1) The radiation coefficient of the PCB surface;
(2) The temperature difference between PCB and adjacent surfaces and their absolute temperature
6. Heat conduction
(1) Install the radiator;
(2) Conduction of other installation structural parts.
7. Thermal convection
(1) Natural convection;
(2) Forced cooling convection.
The analysis of the above-mentioned factors from PCB is an effective way to solve the temperature rise of PCB factories. These factors are often related and dependent on each other in a product and system. Most of the factors should be analyzed according to the actual situation. The specific actual situation can calculate or estimate the parameters such as temperature rise and power consumption more correctly.
Two, some methods of PCB thermal design
1 Heat dissipation through the PCB board itself
The best way to solve the problem of heat dissipation is to improve the heat dissipation capacity of the PCB itself, which is in direct contact with the heating element, and conduct or radiate through the PCB board.
2 High heat-generating components plus radiator and heat conduction plate
3 For equipment using free convection air cooling,
4 Use reasonable wiring design to achieve heat dissipation
5 The components on the same PCB should be arranged as far as possible according to the amount of heat generation and degree of heat dissipation.
6 In the horizontal direction, high-power devices should be placed as close to the edge of the printed board as possible to shorten the heat transfer path;
7 The heat dissipation of PCB in the equipment mainly depends on air flow,
8. The temperature-sensitive device is best placed in the lowest temperature area (such as the bottom of the device). Never place it directly above the heating device. It is best to stagger multiple devices on the horizontal plane.
9 Arrange the components with the highest power consumption and the highest heat generation near the best position for heat dissipation.
10 The RF power amplifier or LED PCB adopts a metal base substrate.
11 Avoid the concentration of hot spots on the PCB, distribute the power evenly on the PCB board as much as possible, and keep the PCB surface temperature performance uniform and consistent.
