PCB Technical - Difficulties in proofing multi-layer PCB circuit boards

Due to the large number of layers in multi-layer circuit boards, users have higher and higher requirements for PCB layer calibration. Generally, the alignment tolerance between the layers is controlled at 75 microns. Taking into account the large unit size of the multilayer circuit board, the high temperature and humidity in the graphics conversion workshop, the overlapping of dislocations caused by the inconsistency of different core boards, and the positioning method between layers, it is more difficult to control the centering of the multilayer circuit board.

Difficulties in internal circuit production

Multilayer circuit boards use special materials such as high TG, high speed, high frequency, thick copper, thin dielectric layer, etc., which puts forward high requirements for internal circuit production and pattern size control. For example, the integrity of impedance signal transmission increases the difficulty of internal circuit manufacturing.

Width and line spacing are small, open circuits and short circuits increase, short circuits increase, and the pass rate is low; there are many thin line signal layers, and the probability of inner AOI leakage detection increases; the inner core board is thin, easy to wrinkle, poor exposure, and easy to curl when the etching machine; High-rise plates are mostly system boards, with larger unit sizes and higher product scrap costs.

Difficulties in compression manufacturing

Many inner core boards and semi-cured boards are superimposed, and defects such as slippage, delamination, resin voids and bubble residues are prone to occur in the stamping production. In the design of the laminated structure, the heat resistance, pressure resistance, glue content and dielectric thickness of the material should be fully considered, and a reasonable multi-layer circuit board material pressing plan should be formulated.

Due to the large number of layers, the expansion and contraction control and the dimensional coefficient compensation cannot maintain consistency, and the thin interlayer insulation layer is likely to cause the interlayer reliability test to fail.

Difficulties in drilling

The use of high-TG, high-speed, high-frequency, and thick copper special plates increases the difficulty of drilling roughness, drilling burrs and de-drilling. There are many layers, the cumulative total copper thickness and the plate thickness, the drilling is easy to break the knife; the dense BGA is many, the CAF failure problem caused by the narrow hole wall spacing; the plate thickness is easy to cause the inclined drilling problem.