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PCB Technical

PCB Technical - PCB power supply circuit board quality control requirements

PCB Technical

PCB Technical - PCB power supply circuit board quality control requirements

PCB power supply circuit board quality control requirements

2021-09-03
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Author:Belle

The requirement of PCB power supply circuit board is high reliability, and the requirement of copper thickness is special. These two points are also difficult for circuit board manufacturers to control, so how can we produce high-reliability PCB power circuit boards?


  1. Material:PCB power supply circuit boards require high stability, so when choosing materials, pay attention to choosing medium and high TG plates.


2. Copper thickness control: Under the same line width design, the thicker the copper, the greater the current that can be carried. Therefore, the PCB power circuit board has a special requirement for copper thickness. According to the different application areas of the power circuit board, the copper thickness The requirements are also different.

Sensiyuan


3. Control of ink thickness: For thick copper power circuit boards, the circuit is easy to expose copper and redden, so it is necessary to do two solder masks to thicken the thickness of the green oil.


4. Quality control: The high reliability of power circuit boards requires strict quality control, including inner layer AOI, electroplating copper thickness test, outer layer AOI, electrical performance test, reliability test, etc.,PCB circuit board The management and control of each link are interlocking and indispensable, so that high-quality products can be made.



PCB board

In the process of PCB board surface production, the effect of gold plating is very good, and the price of gold plating is also a bit expensive. We often have the problem of PCB plating gold surface blackening during the production process. Why does PCB board plating gold surface appear? It's dark, let's understand it together.


  1. Thickness control of electroplating nickel layer: PCB electroplating gold layer is generally very thin, which is reflected on the gold surface. There are many reasons for the blackening of the gold surface due to the thin nickel layer. The thickness of the nickel layer needs to be plated to about 5um.


2. Is the electroplating nickel potion good: If the nickel potion is not well maintained and carbon treatment is not carried out in time, the electroplated nickel layer will easily increase the hardness and brittleness of the plating, which will cause the gold layer to turn black.


3. Gold cylinder control: With good syrup filtration and replenishment, the pollution degree and stability of the gold cylinder is better than that of the nickel cylinder.