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How to strengthen BGA on PCB circuit board to prevent cracking
1. Enhance the anti-deformation ability of the PCB circuit board
The deformation of the circuit board (PCBA board) usually comes from the rapid heating and rapid cooling (thermal expansion and contraction) caused by high temperature reflow (Reflow), and the uneven distribution of parts and copper foil on the circuit board worsens the circuit board. The amount of deformation.
Ways to increase the resistance to deformation of the circuit board include:
1. Increase the thickness of the PCB circuit board. If possible, it is recommended to use a circuit board with a thickness of 1.6mm or more. If you still have to use 0.8mm, 1.0mm, 1.2mm thickness boards, it is recommended to use furnace fixtures to support and strengthen the deformation of the board when passing the furnace. Although you can try to reduce it.
2. Use high Tg PCB material. High Tg means high rigidity, but the price will increase accordingly. This must be a trade-off.
3. Pouring Epoxy glue (potted) on the circuit board. You can also consider pouring glue around the BGA or on the back of the corresponding circuit board to strengthen its stress resistance.
4. Add steel bars around the BGA. If there is space, consider building a house with a supporting iron frame around the BGA to strengthen its ability to resist stress.
2. Reduce PCB distortion
Generally speaking, when the circuit board (PCB) is assembled into the case, it should be protected by the case, but because today’s products are getting thinner and thinner, especially hand-held devices, they often suffer from external force bending or falling impact. The resulting circuit board is deformed.
To reduce the deformation of the circuit board caused by external forces, there are the following methods:
1. Strengthen the shell strength to prevent its deformation from affecting the internal circuit board.
2. Add screws or positioning and fixing mechanisms around the BGA in the printed circuit board. If our purpose is only to protect the BGA, then we can force the mechanism near the BGA to be fixed so that the vicinity of the BGA is not easily deformed.
3. Increase the buffer design of the mechanism to the circuit board. For example, designing some cushioning materials, even if the case is deformed, the internal circuit board can still remain unaffected by external stress. But the life and capacity of the buffer must be considered.
Three, enhance the reliability of BGA
1. Fill the bottom of the BGA with glue (underfill).
2. Increase the amount of solder. But it must be controlled under the condition that no short circuit is allowed.
3. Use SMD (SolderMaskDesigned) layout. Cover the solder pads with green paint.
4. Increase the size of the BGA solder pads on the circuit board. This will make the wiring of the circuit board difficult, because the gap between the ball and the ball that can be routed becomes smaller.
5. Use Vias-in-pad (VIP) design. However, the vias on the solder pads must be filled with electroplating, otherwise there will be bubbles generated during reflow, which will easily cause the solder balls to break from the middle. This is similar to building a house and piling the ground.
6. I strongly suggest that if it is a finished product, it is best to use
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