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PCB circuit board production process
1, open material
Purpose: According to the requirements of the engineering data MI of the PCB circuit board(Shenzhen PCB manufacturer), the large sheets that meet the requirements are cut into small pieces of circuit boards to produce boards. Small sheets that meet customer requirements.
process: large sheet - cutting board according to MI requirements - curium board - beer fillet edging - plate out
2, drilling
Purpose: According to the PCB circuit board engineering data, drill the required aperture at the corresponding position on the sheet material that meets the required size.
process: stacking plate pin - upper plate - drilling - lower plate - inspection and repair
3, heavy copper
Purpose: Immersion copper is to deposit a thin layer of copper on the wall of the insulating hole by chemical method.
process: rough grinding - hanging board - automatic copper sinking line - lower board - dipping% dilute H2SO4 - thickened copper
4, graphics transfer
Purpose: Graphic transfer is to transfer the image on the production film to the PCB circuit board.
Process: (blue oil process): grinding plate - printing the first side - drying - printing the second side - drying - exploding - developing shadow - inspection; (dry film process): hemp board - pressing film - standing - right Position-Exposure-Standing-Development-Check
5. Graphic plating
Purpose: Pattern electroplating is to electroplate a copper layer with the required thickness and a gold-nickel or tin layer with the required thickness on the bare copper skin or hole wall of the circuit pattern.
process: upper board - degreasing - second water washing - micro-etching - water washing - pickling - copper plating - water washing - pickling - tin plating - water washing - lower board
6, Remove the film
Purpose: Use NaOH solution to remove the anti-plating coating film to expose the non-circuit copper layer.
process: water film: insert rack - soak alkali - rinse - scrub - pass machine; dry film: release board - pass machine
7, etching
Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts.
8, green oil
Purpose: Green oil is to transfer the graphic of the green oil film to the board to protect the circuit and prevent the tin on the circuit when welding parts.
Process: grinding plate-printing photosensitive green oil-curing plate-exposure-exposure; grinding plate-printing first side-drying plate-printing second side-drying plate
9, characters
Purpose: Characters are provided as a mark for easy identification.
Process: After the green oil finishes - cool and stand - adjust the screen - print characters - back
10, gold-plated fingers
Purpose: to plate a nickel-gold layer of required thickness on the plug finger to make it more hard and wear-resistant.
process: upper plate - degreasing - washing twice - micro-etching - washing twice - pickling - copper plating - washing - nickel plating - washing - gold plating
spray tin plate (a process in parallel)
Purpose: Multilayer circuit board spray tin is to spray a layer of lead tin on the bare copper surface that is not covered with solder mask to protect the copper surface from corrosion and oxidation to ensure good soldering performance.
process: micro-etching - air drying - preheating - rosin coating - solder coating - hot air leveling - air cooling - washing and air drying
11, molding
Purpose: Organic gongs, beer board, hand gongs, hand-cutting methods to produce the shape required by the customer through die stamping or CNC gong machine
Description: The accuracy of the PCB circuit board data gong machine board and the beer board is higher. The hand gong is second, and the minimum hand-cutting board can only be made with some simple shapes.
12, test
Purpose: Through the electronic test fixture/flying probe test, to detect defects that affect functionality such as open circuits and short circuits that are not easy to find visually.
Process: upper mold - release board - test - pass - FQC visual inspection - unqualified - repair - return test - OK - REJ - scrap
13, final inspection
Purpose: Visually inspect the appearance of the board and repair minor defects to avoid problems and the outflow of defective boards.
Specific work flow: incoming materials - check information - visual inspection - qualified - FQA spot check - qualified - packaging - unqualified - processing - inspection OK
