Technological method for repairing wire warping in circuit board factory
Are you still worrying about the wire bending? Let the editor of the circuit board factory recommend you several techniques for repairing wire warping today!
А. Epoxy resin bonding method on the bottom of printed wire
1. The circuit board factory squeezed epoxy resin under the warped wires.
2. Use appropriate tools to remove all the objects that prevent the wires from coming into close contact with the substrate.
3. After removing the surface coating, use isopropyl alcohol to clean the bottom surface of the warped printed conductor and its surrounding area.
4. Press to make the wire contact with the substrate and keep the pressure until it is firmly adhered. And according to the material supply instructions, it is cured in air or in an oven. Before the epoxy resin is cured, the printed circuit board(PCB) component must not be reprocessed.
b. The epoxy resin bonding method on the surface of the printed wire. This method is similar to the above-mentioned bonding method on the bottom surface of the printed wire, except that the density of the components is high, and the wire cannot be processed or squeezed into the ring underneath it. This method is only used when oxygen resin is used. It is very important to remove the surface coating on the printed circuit board (PCB) before starting the operation.
1. The cleaning method is the same as step 1 of the epoxy resin bonding method on the bottom surface of the printed wire described above.
2. Before the epoxy resin is cured, the repaired parts must not be processed again.
3. According to the material supply instructions, cure in air or in an oven.
4. Coat the surface of the warped wire with epoxy resin at least within 1/8 inch of the damaged area.
Have you understood the several methods of repairing wire warping recommended by Shenzhen Circuit Board Factory for you? Every bit of learning converges into a sea!