Carbon film hybrid integrated PCB

Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated PCB.

1. Integrated circuit is one aspect of microelectronic technology. It forms and interconnects related components on (in) a single substrate with a specific process to form a micro electronic circuit, so as to complete a certain electronic circuit function. It can be divided into three categories according to the manufacturing process: semiconductor integrated circuit, thick film integrated circuit and thin film integrated circuit.

2. Thick film integrated circuit (HFIC) is a kind of integrated circuit which uses thick film technology such as screen printing, sintering or polymerization to make components and their connecting lines in the form of thick film on insulating substrate. The thickness of the film is usually several to tens of microns.

3. Based on the above three kinds of integrated circuits, the thick film hybrid integrated circuit is developed. The film components and interconnect wires are fabricated on a separate insulating substrate with thick film technology. The micro transistor, monolithic semiconductor integrated circuit and other passive devices are pasted on the thick film assembly technology to form a micro circuit with certain functions.

4. Compared with PCB, It has a wide range of component parameters, high precision and stability, good insulation between components and good high frequency characteristics. It is easy to make high voltage, high current, high power, high temperature and radiation resistant circuits. The circuit design is flexible, and the development cycle is short. It is suitable for multiple varieties and small batch production. It is widely used in aerospace, computer, automobile, communication, instrumentation, power supply, etc Consumer products and other electronic products.

5. The application features of thic are as follows:

a. It can be integrated with IC chip to make multi-functional components.

b. Due to the high specific load power that the printed components can bear, the thermal conductivity of the substrate is high, and the module has a large power load capacity, which is suitable for high-power and high-voltage circuits.

c. It can be used in computer because of its short interconnection line and low signal delay.

d. The package module eliminates the early failure circuit in the process of process screening, which has high reliability compared with single chip IC.

e. The package module is much better than single chip IC in moisture resistance, corrosion resistance and rust prevention.

f. It can be applied to the combination of surface packaging technology and chip components, and the production automation level is high.