Технология PCB - технология обработки PCB

PCB process панель PCB cleaning process detailed explanation

1. Cutting: cutting a large sheet of material into small pieces of material needed

Wash board: Wash the dust and impurities on the board machine and air dry.
2. внутренний слой сухой пленки: Вставить слой светочувствительного материала в медную фольгу платы, and then use the black film for alignment exposure and development to form a circuit diagram.
Chemical cleaning:
(1) Remove oxides, garbage, сорт. on the Cu поверхность; if the Cu surface is rough, Он может усилить сцепление между медной поверхностью и светочувствительными материалами.
(2) Process: Degreasing-water washing-micro erosion-high pressure water washing-circulating water washing-water absorption-strong wind drying-hot air drying.
(три) Factors affecting plate washing: degreasing скорость, degreasing agent concentration, температура коррозии, total acidity, Cu2+ concentration, pressure, speed.
(4) Defects are easy to produce: open circuit-poor cleaning effect, вести к выбросу фильма; короткое замыкание грязная очистка может создать мусор.
3. Immersion copper and board power

4. Outer dry film
5. нанесение покрытия рисунком: проведение отверстий и схем для выполнения требований по толщине медного покрытия.
(1) Degreasing: remove the surface oxide layer and surface pollutants;
(2) Acid leaching: remove pollutants in the pretreatment and copper tank;
6. Circuit board electricity gold:
(1) Degreasing: Remove grease and oxides on the surface of the circuit diagram to ensure that the copper surface is clean.
7. Wet green oil:
(1) Pre-treatment: Remove the surface oxide film and roughen the surface to enhance the bonding force between the green oil and the плата цепи surface.
8. Tin spraying process:

(1) Hot water washing: clean the dirt and some ions on the surface of the плата цепи;
(2) Scrubbing: further clean the residues left on the surface of the плата цепи.
9. Immersion gold craft:
(1) Acidic degreasing: remove light grease and oxides on the copper surface to activate and clean the surface to form a surface state suitable for nickel and gold plating.
10. Shape processing
(1) Wash the board: remove surface contaminants and dust. 11. NETEK copper surface treatment

(1) Degreasing: Remove grease and oxides on the surface of the circuit diagram to ensure that the copper surface is clean.

Steps to clean the copper surface:
1. Dry film pressing
2. Before the inner layer oxidation treatment

3. After drilling (remove the slag, remove the colloid produced during the drilling process to make it coarser and clean) (mechanical grinding plate: use ultrasonic cleaning to fully clean the hole, and the copper powder and adhesion in the hole Sex particles are removed)
4. Before chemical copper
5. Before copper plating
6. Before the green paint
7. Before spraying tin (or other solder pad processing procedures)
8. Gold finger before nickel plating

Secondary copper pretreatment:
Degreasing-washing-micro-etching-washing-acid immersion-copper plating-washing the surface of the board surface impurities such as oxidation, отпечаток пальца, and minor objects that may be left on the surface of the outer circuit manufacturing plant of the previous process Remove. и активирован поверхностью, прилипание медью.
A cleaning is required before shipment to remove ion contamination.

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