Rogers RO6002 PCB

Rogers RT / Duroid ro6002 PCB material

Rogers RT / Duroid ro6002 PCB microwave material is a kind of low dielectric constant laminate, which can meet the strict requirements of mechanical reliability and electrical stability in the design of complex microwave structures.

The temperature dependence of dielectric constant was measured from - 55oc to + 150oC. The results show that the dielectric constant of the material has excellent resistance to temperature change, and can meet the requirements of filter, oscillator and delay line designers for stable electrical performance in design.

Rogers ro6002 PCB Main advantages

1. Low loss ensures excellent performance at high frequencies

2. Strictly controlled permittivity and thickness tolerance

3. Excellent electrical and mechanical properties

4. Very low rate of change of dielectric constant with temperature

5. Surface expansion coefficient equivalent to copper foil

6. Low z-axis expansion

7. Low exhaust rate, ideal material for aviation applications

PCB application: Phase array antenna,Ground based and airborne radar systems, Global positioning system, Power backplane,High reliability complex multilayer circuit, Commercial aviation anti collision system,Beamforming network

rogers ro6002 Technical Specifications

For more technical information about rogers ro6002 material, please visit: rogers ro6002 Technical Specification

RT/duroid6000 series, RO3000 series and RO3200 series ™ Series of high frequency PCB board materials are polytetrafluoroethylene (PTFE) composite materials, which contain ceramic filling particles with a larger integral number (>50%). The high filling properties of RT / Duroid 6002, RO3000 series and RO3200 series PCB board materials make them have low Z-axis thermal expansion coefficient (CTE), excellent electroplating through hole reliability, and the flat CTE closely matches with copper to achieve good size stability. The fillers in RT / Duroid 6006 and 6010 have high dielectric constants and reduce circuit size.

The high filling capacity of the material is also prone to porosity of about 5% volume. The micropore in the composite appears to exist at the interface between the filler and PTFE, even though it cannot be detected in the cross section by scanning electron microscopy. Because of the low surface performance of PTFE and the processed ceramic filler, the micropores will not result in high water absorption. However, low surface tension liquids such as organic solvents and aqueous solutions containing surfactants can penetrate into micropores.

Because PTFE and ceramic fillers are chemically inert to most processing chemicals, liquid absorption only fills micropores and does not alter the physical properties of these PCB board materials. However, before the plates are processed at high temperatures (e.g., lamination, Sn/Pb reflow soldering, etc.), the volatiles that penetrate the composite materials must be removed. Rinse thoroughly immediately after contact with processing chemicals to ensure that no non-volatile soluble substances are left behind when baking the parts.

Volatile Removal

Failure to remove volatiles prior to high-temperature processes such as lamination or reflow soldering can result in dielectric foaming or delamination. The following baking treatments have been found to eliminate problems associated with volatiles during high temperature processes.

BASIC GUIDE FOR BAKING

1. Before lamination. Before lamination, the inner laminate to be laminated should be baked for at least half an hour in vacuum or at 300 degrees F of nitrogen. If the plates are pressed together in a high-pressure sterilizer, the baking process can precede the pressing process.

2. Before the chemical deposit of copper. Bake the plates at least 1 hour in vacuum or at 300 degrees F of nitrogen before chemical precipitation of copper. This is the key to baking because once the edges and mechanical properties of the multilayer plates are covered by electroless copper plating, ethylene glycol ether absorbed from commercially available sodium etchants or alcohol from flushing is difficult to remove.

3. Before reflow soldering. Before reflux bonding or hot air leveling (HASL), the board is baked at least 2 hours in a vacuum or in nitrogen at 300 degrees F. After baking, the residence time after applying flux is not more than 30 seconds. If re-processing is required, the above baking treatment must be repeated.

When baking sheets in a nitrogen purification bag, the nitrogen airflow from the bag is needed to ensure that the volatiles in the bag are removed. Similarly, care must be taken when using vacuum bags to ensure that the vacuum pipeline is not blocked by the bag material. If volatiles remain in the bag, they will condense on the board when it cools down. This significantly reduces the effectiveness of baking. If the oven is not preheated, the recommended baking time should be used to bring the oven to a temperature.

Dielectric pollution

Failure to flush these PCB board materials sufficiently after contact with processing chemicals can sometimes lead to dielectric contamination or increase dielectric loss. These problems can be prevented by minimizing exposure to low-surface-energy solvents containing non-volatile components and using a reasonable flushing process. For example, it is not allowed to immerse the plate in the etchant longer than the etching time required. In addition, the plate must be flushed immediately after etching.

Basic Guidelines for Preventing Dielectric Pollution

1. Minimize exposure to low surface energy solvents containing non-volatile components.

2. Dump and rinse regularly to prevent non-volatile residues.

3. If the dielectric surface is in contact with a water-soluble solution with low surface energy or a water-soluble organic solution containing non-volatile substances, the plate should be immersed in 70 F hot distilled water for 15 minutes immediately.

4. If the dielectric surface is in contact with water-insoluble solvents containing non-volatile substances, the plate should be immersed in water-soluble organic solvents (e.g. methanol, ethanol or isopropanol) for 15 minutes immediately, and then in hot distilled water for 15 minutes.