Rogers RO4730G3 Microwave Printed Circuit Board

Rogers launched the RO4730G3 UL 94 V-0 antenna level laminate to meet current and future higher performance requirements in active antenna arrays, small base stations, 4G base transceiver, Internet of things devices and emerging 5g wireless system applications.

This flame retardant (UL 94V-0) RO4730G3 thermosetting laminate material is a derivative of Rogers' long trusted and popular circuit material for base station antenna applications. It has a low dielectric constant of 3.0, which is preferred by antenna designers, and a z-direction dielectric constant deviation of ± 0.05 at 10 GHz.

RO4730G3 laminate is made of ceramic hydrocarbon material and low loss LoPro? Copper foil. It can provide excellent passive intermodulation performance (usually better than - 160 DBC), which is very attractive for intermodulation sensitive HF antennas. The Printed Circuit Board material of RO4730G3 is 30% lighter than that of PTFE, and its high glass transition temperature (TG) over + 280 ° C makes it compatible with automatic assembly process. In the temperature range of - 55 degree Celsius to + 288 degree Celsius, the coefficient of thermal expansion (CTE) in Z direction is only 30.3 ppm / C, which is conducive to the reliability of electroplated through-hole structure in multilayer circuit assembly. In addition, the lead-free process resistance of the RO4730G3 laminate material can provide better flexural strength than the ro4000jxr material.

The performance of RO4730G3, a new type of laminate for antenna level circuits, is stable with temperature. The material has a coefficient of thermal expansion (CTE) that matches copper and has a very low rate of thermal change in the Z direction of the dielectric constant over the temperature range from - 50 ° C to + 150 ° C (+ 26 ppm / C at 10 GHz). At the same time, the high frequency loss of RO4730G3 is very low, and its loss factor is 0.0023 at 2.5 GHz and 0.0029 at 10 GHz.

RO4730G3 laminate material provides a practical and cost-effective material solution for current 4G, IOT wireless devices, and active antenna arrays and PCB antennas in future 5g wireless devices. Combined with the right materials, ro4730g3 material can provide the best combination of price, performance and durability.

It is compatible with the conventional rf-4700 laminate and has no special requirements for high-temperature soldering of the RF-4700 laminate. This material is an economical alternative to PTFE antenna material and can help designers achieve high cost performance.

The resin system of RO4700 dielectric material has the necessary properties to achieve ideal antenna performance. The coefficient of thermal expansion (CTE) of X and Y axes is similar to that of copper foil. Good fit of thermal expansion coefficient reduces the stress in PCB antenna. The glass transition temperature of RO4700 material is higher than 280 ° C (536 ° f), which makes the z-axis CTE lower, thus ensuring excellent through-hole plating reliability.

The loss of RO4730G3 is higher than that of RO4730jxr due to the addition of flame retardant filler. At 3.5GHz frequency, the loss of RO4730G3 with 30.7mil thickness increases by 0.0009db/cm compared with that of RO4730jxr at 3.5GHz frequency.

*Cost advantage

*High Performance PCB antenna and active antenna array for 5g and IOT

*To meet the 4G, 5g and IOT high cost performance, high performance PCB antenna and active antenna array applications

For more technical information about ro4730, please visit: Rogers RO4730 Technical Specifications

Rogers RO4730 Technical Specifications

ipcbintroduction

ipcb company specialized with the RF PCB manufacturing for more than 17 years in China. We know how much the proper RF material would affect to the performance of the board .The parameters such as RF microwave energy levels,operating frequency, operating temperature range,current and voltage are of great importance when choosing the suitable material for the high frequency PCB fabricating. Getting familiar with those RF PCB material is one of our job,Check below material listing for refer. We have enough of them in stock to ensure the fast delivery.The confidence towards our product quality is from our experiences engineers / production team, They cooperate closely with our QA department to provide a qualified product, We didn’t expect to achieve a big thumb from our customers, But more and more repeat orders speak out the satisfaction of them. Quality is the core value of our company, We know the importance of quality for a long-term business, Thanks very much to our customers that accompany with us to developed / improved our capacity and technical field for the past 17 years.

RF/Microwave PCB material:

Rogers RO4350B / RO3003 / RO4003 / RO3006 / RT/Duroid 5880 / RT5870 / RO4730 and etc.

Arlon / Isola / Taconic / PTFE F4BM / Teflon material also shouldn’t be forgotten.

Hybrid PCB material (Mixed dielectric / Laminate)

Rogers RO4350B + FR4 / RO4350B + IT180 / RO4003C + FR4 / RO3010 + FR4 / RO3003 + FR4 / RO3010 + FR4 etc.

Radio Frequency (RF) microwave PCB application

RF Microwaves PCBs (printed circuit board) are used in various of fields, Such as Consumer Electronics / Military/Space / High power / Medical / Automotive / Industrial ect.

RF/Microwave PCB application

PCB printed circuit boards with radio frequency(RF PCBs) are an increasingly used technique within the PCB industry.

--RF PCB with a high frequency with works above 5G.

--Microwave PCB with works above 5 GHz radio frequency.

RF-pcb’s are used in different applications such as remote controls(wireless controls)security,smartphones,sensors etc.

New technologies make more and more use of these RF applications.

This asks for a manufacturing according to high quality standards and choosing the right RF materials depending on the application.

It is important that one knows the properties of the various materials.Choosing the right material is perhaps the most critical decision in the production process of the RF PCB.

Surface finishing: OSP / ENIG / HASL LF / Plated gold / flash gold / Immersion Tin / Immersion silver / Electrolytic gold

Capacity: Golden finger / Heavy copper / Blind buried via / impendance control / filled with resion / carbon ink / backdrill / countersink / depth drilling / half plated hole / pressfit hole / peelable blue mask / peelable solderstop / thick copper / oversize

Material: Rogers RO4350B / RO3003 / RO4003 / RO3006 / RT/Duroid 5880 / RT5870 / RO4730 and Arlon / Isola / Taconic / PTFE F4BM / Teflon material etc.

Layer: 2L 4L 6L 8L 10L 12L 14L 16L 18L 20L 22L 24L 26L 28L 30L

Dielectric Constant (DK): 2.20 / 2.55 / 3.00 / 3.38 / 3.48 / 3.50 / 3.6 / 6.15 / 10.2

Application: Consumer Electronics / Military/Space / Antenna & Communications System / High Power / Medical / Automotive / Industrial / Handheld device cellular / Wifi Antenna / Telematics and infotainment / Wifi/Computing/Radar/Power Amplifiers