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PCBA factories throughout the schematic drawing phase, consider the need for pattern decisions during the layout phase to ensure adequate bypass capacitance and interface layers are designed. SMT technology uses IC. Make sure that appropriate decoupling capacitors are used near the ground (preferably at the ground level). The appropriate size of capacitors depends on the application, SMT technology at the capacitor patch factory, and the frequency involved. When the bypass capacitors are placed at both ends of the power supply and the ground pin and close to the corresponding IC pin, the electromagnetic compatibility and magnetic sensitivity performance of the circuit will be optimized.
Operating bills of materials by SMT technicians in PCBA board factories (BOM) To check for virtual parts, which do not have contours associated with them, nor are they transferred to the layout, generate BOM and view all virtual components in the design. The only entries should be power and ground signals, PCBAa processing because they are considered virtual parts and are handled exclusively in the schematic environment rather than in the layout unless they are used only for simulation purposes The parts displayed in the virtual part should be replaced by the parts with footprints.
Check if there is enough data in the BOM report, after running the BOM report, check it and continue to fill in any incomplete parts of all these parts, supplier SMT patches, or manufacturer information.
"Similar to other manufacturing processes, there are many factors that affect the reliability and functionality of printed PCBA circuit boards in the SMT process of PCBA assembly. These factors include the materials and design of the template used, solder paste, placement of various components. Considering the actual PCBA and SMT equipment used and the specific requirements required, it is also important in the process of PCBA board processing in SMT affix processing plant Solder templates and soldering.
Solder template and patch welding.
In SMT sheet factory PCBA processing, the thickness of the template steel mesh usually matches the needs of all the components in the printed circuit board. Solder paste can be applied to the printed circuit board through screen printing, and the volume is determined by the thickness and aperture of the template. If the thickness of the template does not match all the components on the same board, the pressure-reducing template will be considered.
During SMT patch assembly in PCBA, SMR technology uses electroforming templates made of nickel or stainless steel to ensure uniform and high-quality welding of the plates. In addition, it is recommended to bypass the corners of the holes to provide good paste release. The holes of the solder joints must be of the same size as the metal pads placed on the PCBA plates. Finally, in order to achieve the best results during assembly, The template should be split into smaller openings.
