PCBA Tech - How to handle BGA repair and disassembly of PCBA?

Nowadays, with the development of electronic products towards miniaturization, portability, networking, science and technology and high performance, PCBA manufacturer have higher and higher requirements for PCBA circuit assembly technology and the precision of electronic components on PCBA processing circuit board. Most chips are smaller and smaller, and there are more and more pins, Therefore, it also greatly improves the technical requirements of PCBA processing and PCBA defective product repair in the patch processing plant, and also brings corresponding difficulties to the relevant technical operators of SMT technology manufacturers in the patch processing plant.

Therefore, PCBA manufacturer generally need high-precision packaging technology, and usually adopt PCBA packaging processes such as BGA, which can better ensure the quality stability of PCBA products and improve the process accuracy requirements of scientific and technological production.

Generally, BGA, QFP, etc. are msd3, which must be treated before PCBA repair in the patch processing plant: the surface temperature resistance of all components and accessories on PCBA is determined, and the baking conditions are generally 60 ± 5 degree Celsius and baking for 48 ~ 72h (depending on the actual situation of PCBA). After baking, the local heating method can be used for repair.

The necessity of PCBA baking is involved in PCBA manufacturers - the moisture inside the components on PCBA is slowly discharged through relatively slow heat, so as to avoid the rapid expansion of moisture inside the components on PCBA under relatively rapid temperature rise conditions such as reflow furnace welding of SMT technology equipment, resulting in stress affecting the reliability of alloy points / plastic seals of components on PCBA, The components on PCBA will burst, resulting in the risk of potential failure of PCBA components.